Datasheet TLA432 (Texas Instruments) - 4

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TLA431, TLA432
SNVSCR4A – JULY 2024 – REVISED OCTOBER 2024
www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VKA Cathode Voltage(2) 37 V IKA Continuous Cathode Current Range –100 150 mA II(ref) Reference Input Current –0.05 10 mA TJ Operating Junction Temperature Range –40 150 C Tstg Storage Temperature Range –65 150 C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to ANODE, unless otherwise noted.
6.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001pins(1) ±2000 Electrostatic V(ESD) V discharge Charged-device model (CDM), per JEDEC specification JESD22- ±1000 VC101(2) ±1000 (1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
See (1)
MIN MAX UNIT
VKA Cathode Voltage VREF 36 V IKA Continuous Cathode Current Range 0.2 100 mA TLA43xxI –40 85 C TA Operating Free-Air Temperature TLA43xxQ –40 125 C (1) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
6.4 Thermal Information TLA43x THERMAL METRIC
(1)
DBZ UNIT 3 PINS
RθJA Junction-to-ambient thermal resistance 218.8 C/W RθJC(top) Junction-to-case (top) thermal resistance 115.8 C/W RθJB Junction-to-boardthermal resistance 53.1 C/W ψJT Junction-to-top characterization resistance 16.6 C/W ψJB Junction-to-board characterization resistance 52.6 C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: TLA431 TLA432 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Device Comparison Table 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Typical Characteristics 7 Parameter Measurement Information 7.1 Temperature Coefficient 7.2 Dynamic Impedance 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.4 Device Functional Modes 8.4.1 Closed Loop 8.4.1.1 Stability (Closed Loop) 8.4.2 Open Loop (Comparator) 9 Applications and Implementation 9.1 Application Information 9.2 Typical Applications 9.2.1 Shunt Regulator/Reference 9.2.1.1 Design Requirements 9.2.1.2 Detailed Design Procedure 9.2.1.2.1 Programming Output/Cathode Voltage 9.2.1.2.2 Total Accuracy 9.2.1.2.3 Start-Up Time 9.2.1.3 Application Curve 9.2.2 Comparator With Integrated Reference 9.2.2.1 Design Requirements 9.2.2.2 Detailed Design Procedure 9.2.2.2.1 Basic Operation 9.2.2.2.1.1 Overdrive 9.2.2.2.2 Output Voltage and Logic Input Level 9.2.2.2.2.1 Input Resistance 9.2.2.3 Application Curve 9.3 System Examples 9.4 Power Supply Recommendations 9.5 Layout 9.5.1 Layout Guidelines 9.5.2 Layout Example 10 Device and Documentation Support 10.1 Device Nomenclature 10.2 Related Links 10.3 Receiving Notification of Documentation Updates 10.4 Support Resources 10.5 Trademarks 10.6 Electrostatic Discharge Caution 10.7 Glossary 11 Revision History 12 Mechanical, Packaging, and Orderable Information