FOD410, FOD4108, FOD4116, FOD4118REFLOW PROFILE 245 _C, 10 to 30 seconds 300 250 260_C peak _ C) 200 150 100 Time above 183_C, < 160 seconds Temperature ( 50 Ramp up = 2 to 10_C/second 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Time (Minute) •Peak reflow temperature: 262_C (package surface temperature) •Time of temperature higher than 18 5_C for 160 seconds or less •One time soldering reflow is recommended Figure 14. Reflow ProfileORDERING INFORMATIONPart NumberPackageShipping † FOD410 DIP 6−Pin Tube (50 Units) FOD410S SMT 6−Pin (Lead Bend) Tube (50 Units) FOD410SD SMT 6−Pin (Lead Bend) Tape and Reel (1000 Units) FOD410V DIP 6−Pin, DIN EN/IEC60747−5−5 Option Tube (50 Units) FOD410SV SMT 6−Pin (Lead Bend), DIN EN/IEC60747−5−5 Option Tube (50 Units) FOD410SDV SMT 6−Pin (Lead Bend), DIN EN/IEC60747−5−5 Option Tape and Reel (1000 Units) FOD410TV DIP 6−Pin, 0.4” Lead Spacing, DIN EN/IEC60747−5−5 Option Tube (50 Units) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 6. The product orderable part number system listed in this table also applies to the FOD4108, FOD4116, and FOD4118 product families. www.onsemi.com9