Datasheet RB751V40T1G (ON Semiconductor) - 4

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Seiten / Seite5 / 4 — PACKAGE DIMENSIONS. SOD−323. SCALE 4:1. MILLIMETERS. INCHES. DIM MIN. …
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PACKAGE DIMENSIONS. SOD−323. SCALE 4:1. MILLIMETERS. INCHES. DIM MIN. NOM. MAX. MIN. NOTE 5. NOTE 3. GENERIC. MARKING DIAGRAM*

PACKAGE DIMENSIONS SOD−323 SCALE 4:1 MILLIMETERS INCHES DIM MIN NOM MAX MIN NOTE 5 NOTE 3 GENERIC MARKING DIAGRAM*

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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SOD−323
2 2 CASE 477−02 ISSUE H DATE 13 MAR 2007 1 1 STYLE 1 STYLE 2
SCALE 4:1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
HE
2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
D
WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS.
b 1 2 E MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A
0.80 0.90 1.00 0.031 0.035 0.040
A1
0.00 0.05 0.10 0.000 0.002 0.004
A3
0.15 REF 0.006 REF
A3 b
0.25 0.32 0.4 0.010 0.012 0.016
C
0.089 0.12 0.177 0.003 0.005 0.007
D
1.60 1.70 1.80 0.062 0.066 0.070
A E
1.15 1.25 1.35 0.045 0.049 0.053
L
0.08 0.003
HE
2.30 2.50 2.70 0.090 0.098 0.105
L C A1 NOTE 5 NOTE 3 GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT*
XX M XX M 0.63 0.025 0.83 STYLE 1 STYLE 2 0.033 XX = Specific Device Code 1.60 M = Date Code 0.063 2.85 *This information is generic. Please refer to 0.112 device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and STYLE 1: STYLE 2: Mounting Techniques Reference Manual, SOLDERRM/D. PIN 1. CATHODE (POLARITY BAND) NO POLARITY 2. ANODE
DOCUMENT NUMBER: 98ASB17533C
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DESCRIPTION: SOD−323 PAGE 1 OF 1
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