Datasheet MAX8863, MAX8864 (Analog Devices) - 2
| Hersteller | Analog Devices |
| Beschreibung | Low-Dropout, 120mA Linear Regulators |
| Seiten / Seite | 10 / 2 — Absolute Maximum Ratings. Package Thermal Characteristics (Note 1). Note … |
| Dateiformat / Größe | PDF / 2.0 Mb |
| Dokumentensprache | Englisch |
Absolute Maximum Ratings. Package Thermal Characteristics (Note 1). Note 1:. www.maximintegrated.com/thermal-tutorial
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Textversion des Dokuments
MAX8863T/S/R, Low-Dropout, 120mA Linear Regulators MAX8864T/S/R
Absolute Maximum Ratings
VIN to GND ...-7V to +7V Operating Temperature Range ... -40°C to +85°C Output Short-Circuit Duration ... Infinite Operating Temperature SET to GND ..-0.3V to +7V Range (MAX8863TMUK/PR3+).. -55°C to +125°C SHDN to GND ..-7V to +7V Junction Temperature ..+150°C SHDN to IN ..-7V to +0.3V Storage Temperature Range .. -65°C to +150°C OUT to GND ...-0.3V to (VIN + 0.3V) Lead Temperature (soldering, 10s) ...+300°C Continuous Power Dissipation (multilayer board, TA = +70°C) Soldering Temperature (reflow) ...+260°C SOT23 (3.9mW/°C above +70°C) ..312.6mW Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 1)
SOT23 Junction-to-Ambient Thermal Resistance (θJA) ...255.9°C/W Junction-to-Case Thermal Resistance (θJC) ...81°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
.
Electrical Characteristics
(VIN = +3.6V, VGND = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Input Voltage (Note 3) VIN 2.5 6.5 V MAX886_T 3.05 3.15 3.25 Output Voltage V 0mA ≤ IOUT ≤ OUT 50mA, SET = GND MAX886_S 2.75 2.84 2.93 V MAX886_R 2.70 2.80 2.88 Adjustable Output Voltage Range (Note 4) VOUT VSET 6.5 V Maximum Output Current 120 mA Current Limit (Note 5) ILIM 280 mA I Ground Pin Current I LOAD = 0mA 68 150 Q SET = GND µA ILOAD = 50mA 80 I Dropout Voltage (Note 6) OUT = 1mA 1.1 mV IOUT = 50mA 55 120 Line Regulation ∆V VIN = 2.5V to 6.5V, SET tied to OUT, LNR IOUT = 1mA -0.15 0 +0.15 %/V SET = GND 0.011 0.040 Load Regulation ∆V IOUT = 0mA to LDR 50mA %/mA SET tied to OUT 0.006 C Output Voltage Noise 10Hz to 1MHz OUT = 1µF 350 µVRMS COUT = 100µF 220
SHUTDOWN
V SHDN Input Threshold IH 2.0 V VIL 0.4 www.maximintegrated.com Maxim Integrated │
2
Absolute Maximum Ratings
VIN to GND ...-7V to +7V Operating Temperature Range ... -40°C to +85°C Output Short-Circuit Duration ... Infinite Operating Temperature SET to GND ..-0.3V to +7V Range (MAX8863TMUK/PR3+).. -55°C to +125°C SHDN to GND ..-7V to +7V Junction Temperature ..+150°C SHDN to IN ..-7V to +0.3V Storage Temperature Range .. -65°C to +150°C OUT to GND ...-0.3V to (VIN + 0.3V) Lead Temperature (soldering, 10s) ...+300°C Continuous Power Dissipation (multilayer board, TA = +70°C) Soldering Temperature (reflow) ...+260°C SOT23 (3.9mW/°C above +70°C) ..312.6mW Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 1)
SOT23 Junction-to-Ambient Thermal Resistance (θJA) ...255.9°C/W Junction-to-Case Thermal Resistance (θJC) ...81°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
.
Electrical Characteristics
(VIN = +3.6V, VGND = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Input Voltage (Note 3) VIN 2.5 6.5 V MAX886_T 3.05 3.15 3.25 Output Voltage V 0mA ≤ IOUT ≤ OUT 50mA, SET = GND MAX886_S 2.75 2.84 2.93 V MAX886_R 2.70 2.80 2.88 Adjustable Output Voltage Range (Note 4) VOUT VSET 6.5 V Maximum Output Current 120 mA Current Limit (Note 5) ILIM 280 mA I Ground Pin Current I LOAD = 0mA 68 150 Q SET = GND µA ILOAD = 50mA 80 I Dropout Voltage (Note 6) OUT = 1mA 1.1 mV IOUT = 50mA 55 120 Line Regulation ∆V VIN = 2.5V to 6.5V, SET tied to OUT, LNR IOUT = 1mA -0.15 0 +0.15 %/V SET = GND 0.011 0.040 Load Regulation ∆V IOUT = 0mA to LDR 50mA %/mA SET tied to OUT 0.006 C Output Voltage Noise 10Hz to 1MHz OUT = 1µF 350 µVRMS COUT = 100µF 220
SHUTDOWN
V SHDN Input Threshold IH 2.0 V VIL 0.4 www.maximintegrated.com Maxim Integrated │
2