Datasheet IRF840L, SiHF840L (Vishay) - 8
| Hersteller | Vishay |
| Beschreibung | Power MOSFET |
| Seiten / Seite | 10 / 8 — Package Information. I2PAK (TO-262) (HIGH VOLTAGE). MILLIMETERS. INCHES. … |
| Dateiformat / Größe | PDF / 221 Kb |
| Dokumentensprache | Englisch |
Package Information. I2PAK (TO-262) (HIGH VOLTAGE). MILLIMETERS. INCHES. DIM. MIN. MAX. Notes
Modelllinie für dieses Datenblatt
Textversion des Dokuments
Package Information
Vishay Siliconix
I2PAK (TO-262) (HIGH VOLTAGE)
(Datum A) A B E A c2 E A L1 Seating D1 plane D C C L2 B B L A c E1 3 x b2 A1 Section A - A 3 x b Base 2 x e metal Plating b1, b3 0.010 M A M B c c1 (b, b2) Lead tip Section B - B and C - C Scale: None
MILLIMETERS INCHES MILLIMETERS INCHES DIM. MIN. MAX. MIN. MAX. DIM. MIN. MAX. MIN. MAX.
A 4.06 4.83 0.160 0.190 D 8.38 9.65 0.330 0.380 A1 2.03 3.02 0.080 0.119 D1 6.86 - 0.270 - b 0.51 0.99 0.020 0.039 E 9.65 10.67 0.380 0.420 b1 0.51 0.89 0.020 0.035 E1 6.22 - 0.245 - b2 1.14 1.78 0.045 0.070 e 2.54 BSC 0.100 BSC b3 1.14 1.73 0.045 0.068 L 13.46 14.10 0.530 0.555 c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.065 c1 0.38 0.58 0.015 0.023 L2 3.56 3.71 0.140 0.146 c2 1.14 1.65 0.045 0.065 ECN: S-82442-Rev. A, 27-Oct-08 DWG: 5977
Notes
1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outmost extremes of the plastic body. 3. Thermal pad contour optional within dimension E, L1, D1, and E1. 4. Dimension b1 and c1 apply to base metal only. Document Number: 91367 www.vishay.com Revision: 27-Oct-08 1
Vishay Siliconix
I2PAK (TO-262) (HIGH VOLTAGE)
(Datum A) A B E A c2 E A L1 Seating D1 plane D C C L2 B B L A c E1 3 x b2 A1 Section A - A 3 x b Base 2 x e metal Plating b1, b3 0.010 M A M B c c1 (b, b2) Lead tip Section B - B and C - C Scale: None
MILLIMETERS INCHES MILLIMETERS INCHES DIM. MIN. MAX. MIN. MAX. DIM. MIN. MAX. MIN. MAX.
A 4.06 4.83 0.160 0.190 D 8.38 9.65 0.330 0.380 A1 2.03 3.02 0.080 0.119 D1 6.86 - 0.270 - b 0.51 0.99 0.020 0.039 E 9.65 10.67 0.380 0.420 b1 0.51 0.89 0.020 0.035 E1 6.22 - 0.245 - b2 1.14 1.78 0.045 0.070 e 2.54 BSC 0.100 BSC b3 1.14 1.73 0.045 0.068 L 13.46 14.10 0.530 0.555 c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.065 c1 0.38 0.58 0.015 0.023 L2 3.56 3.71 0.140 0.146 c2 1.14 1.65 0.045 0.065 ECN: S-82442-Rev. A, 27-Oct-08 DWG: 5977
Notes
1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outmost extremes of the plastic body. 3. Thermal pad contour optional within dimension E, L1, D1, and E1. 4. Dimension b1 and c1 apply to base metal only. Document Number: 91367 www.vishay.com Revision: 27-Oct-08 1