Datasheet ADA4097-1, ADA4097-2 (Analog Devices) - 8
| Hersteller | Analog Devices |
| Beschreibung | 50 V, 130 kHz, 32.5 µA per Channel, Robust, Over-The-Top, Precision Op Amps |
| Seiten / Seite | 31 / 8 — ADA4097-1/ADA4097-2. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter. Rating |
| Dateiformat / Größe | PDF / 1.8 Mb |
| Dokumentensprache | Englisch |
ADA4097-1/ADA4097-2. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter. Rating
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ADA4097-1/ADA4097-2 ABSOLUTE MAXIMUM RATINGS Table 3.
The PD due to the load drive depends on the application. The PD
Parameter Rating
due to load drive is calculated by multiplying the load current by Supply Voltage1 the associated voltage drop across the devices. RMS voltages and Transient 60 V currents must be used in these calculations. Continuous 50 V Airflow increases heat dissipation, effectively reducing θJA. Addi- Power Dissipation (PD) See Figure 3 tional metal that is directly in contact with the package leads from Differential Input Voltage ±80 V metal traces through vias, ground, and power planes reduces θJA. ±IN and ±INx Pin Voltage2 Figure 3 shows the maximum P Continuous −10 V to +80 V D vs. TA for the single 6-lead TSOT package on a JEDEC standard, 4‑layer board, with −VS connected Survival −15 V to +80 V to a pad that is thermally connected to a printed circuit board (PCB) ±IN and ±INx Pin Current2 10 mA plane. θJA values are approximations. SHDN and SHDNx Pin Voltage3 −0.3 V to +60 V Storage Temperature Range −65°C to +150°C Operating Temperature Range −55°C to +150°C Lead Temperature (Soldering, 10 sec) 300°C TJ 175°C 1 Maximum supply voltage is limited by the TDDB of the on-chip capacitor ox- ides. The amplifiers tolerate temporary transient overshoot up to the specified transient maximum rating. The continuous operating supply voltage must be limited to no more than 50 V. 2 ±IN refers to the +IN and −IN pins on the ADA4097-1, and ±INx refers to the +IN1, −IN1, +IN2, and −IN2 pins on the ADA4097-2. 3 SHDN is Pin 5 on the ADA4097-1, and SHDNx refers to the SHDN1 and SHDN2 pins (Pin 5 and Pin 6, respectively) on the ADA4097-2 (10-lead LFCSP).
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating
THERMAL RESISTANCE
only; functional operation of the product at these or any other conditions above those indicated in the operational section of this Thermal performance is directly linked to PCB design and operating specification is not implied. Operation beyond the maximum operat- environment. Careful attention to PCB thermal design is required. ing conditions for extended periods may affect product reliability. θJA is the junction to ambient thermal resistance, and θJC is the T junction-to-case thermal resistance. J exceeding 125°C promotes accelerated aging. The ADA4097-1/ ADA4097-2 demonstrate ±25 V supply operation beyond 1000
Table 4. Thermal Resistance
hours at TA = 150°C.
Package Type θJA θJC Unit MAXIMUM POWER DISSIPATION
UJ-6 192 51 °C/W The maximum safe PD on the devices is limited by the associated R-8 120 38 °C/W rise in either T RM-8 163 40 °C/W C or TJ on the die. At approximately TC = 150°C, which is the glass transition temperature, the properties of the 05-08-1699 43 5.5 °C/W plastic changes. Exceeding this temperature limit, even temporarily,
ELECTROSTATIC DISCHARGE (ESD) RATINGS
may change the stresses that the package exerts on the die, which permanently shifts the parametric performance of the ADA4097-1/ The following ESD information is provided for handling of ESD-sen- ADA4097-2. Exceeding T sitive devices in an ESD protected area only. J = 175°C for an extended period may result in changes in the silicon devices and may potentially cause Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. failure of the devices. Field induced charged device model (FICDM) per ANSI/ESDA/JE- The PD on the package is the sum of the quiescent power dissipa- DEC JS-002. tion and the power dissipated in the package due to the output load drive. The quiescent power is expressed as VSY × ISY, where ISY is the quiescent current.
analog.com Rev. A | 8 of 31
Document Outline Features Applications General Description Typical Application Circuit Specifications 5 V Supply ±15 V Supply Absolute Maximum Ratings Maximum Power Dissipation Thermal Resistance Electrostatic Discharge (ESD) Ratings ESD Ratings for ADA4097-1/ADA4097-2 ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Input Protection Over-The-Top Operation Considerations Output Shutdown Pins (SHDN and SHDNx) Applications Information Large Resistor Gain Operation Recommended Values for Various Gains Noise Distortion Power Dissipation and Thermal Shutdown Circuit Layout Considerations Power Supply Bypassing Grounding ESD Protection when Powered Related Products Typical Applications Outline Dimensions Ordering Guide Evaluation Boards
ADA4097-1/ADA4097-2 ABSOLUTE MAXIMUM RATINGS Table 3.
The PD due to the load drive depends on the application. The PD
Parameter Rating
due to load drive is calculated by multiplying the load current by Supply Voltage1 the associated voltage drop across the devices. RMS voltages and Transient 60 V currents must be used in these calculations. Continuous 50 V Airflow increases heat dissipation, effectively reducing θJA. Addi- Power Dissipation (PD) See Figure 3 tional metal that is directly in contact with the package leads from Differential Input Voltage ±80 V metal traces through vias, ground, and power planes reduces θJA. ±IN and ±INx Pin Voltage2 Figure 3 shows the maximum P Continuous −10 V to +80 V D vs. TA for the single 6-lead TSOT package on a JEDEC standard, 4‑layer board, with −VS connected Survival −15 V to +80 V to a pad that is thermally connected to a printed circuit board (PCB) ±IN and ±INx Pin Current2 10 mA plane. θJA values are approximations. SHDN and SHDNx Pin Voltage3 −0.3 V to +60 V Storage Temperature Range −65°C to +150°C Operating Temperature Range −55°C to +150°C Lead Temperature (Soldering, 10 sec) 300°C TJ 175°C 1 Maximum supply voltage is limited by the TDDB of the on-chip capacitor ox- ides. The amplifiers tolerate temporary transient overshoot up to the specified transient maximum rating. The continuous operating supply voltage must be limited to no more than 50 V. 2 ±IN refers to the +IN and −IN pins on the ADA4097-1, and ±INx refers to the +IN1, −IN1, +IN2, and −IN2 pins on the ADA4097-2. 3 SHDN is Pin 5 on the ADA4097-1, and SHDNx refers to the SHDN1 and SHDN2 pins (Pin 5 and Pin 6, respectively) on the ADA4097-2 (10-lead LFCSP).
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating
THERMAL RESISTANCE
only; functional operation of the product at these or any other conditions above those indicated in the operational section of this Thermal performance is directly linked to PCB design and operating specification is not implied. Operation beyond the maximum operat- environment. Careful attention to PCB thermal design is required. ing conditions for extended periods may affect product reliability. θJA is the junction to ambient thermal resistance, and θJC is the T junction-to-case thermal resistance. J exceeding 125°C promotes accelerated aging. The ADA4097-1/ ADA4097-2 demonstrate ±25 V supply operation beyond 1000
Table 4. Thermal Resistance
hours at TA = 150°C.
Package Type θJA θJC Unit MAXIMUM POWER DISSIPATION
UJ-6 192 51 °C/W The maximum safe PD on the devices is limited by the associated R-8 120 38 °C/W rise in either T RM-8 163 40 °C/W C or TJ on the die. At approximately TC = 150°C, which is the glass transition temperature, the properties of the 05-08-1699 43 5.5 °C/W plastic changes. Exceeding this temperature limit, even temporarily,
ELECTROSTATIC DISCHARGE (ESD) RATINGS
may change the stresses that the package exerts on the die, which permanently shifts the parametric performance of the ADA4097-1/ The following ESD information is provided for handling of ESD-sen- ADA4097-2. Exceeding T sitive devices in an ESD protected area only. J = 175°C for an extended period may result in changes in the silicon devices and may potentially cause Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. failure of the devices. Field induced charged device model (FICDM) per ANSI/ESDA/JE- The PD on the package is the sum of the quiescent power dissipa- DEC JS-002. tion and the power dissipated in the package due to the output load drive. The quiescent power is expressed as VSY × ISY, where ISY is the quiescent current.
analog.com Rev. A | 8 of 31
Document Outline Features Applications General Description Typical Application Circuit Specifications 5 V Supply ±15 V Supply Absolute Maximum Ratings Maximum Power Dissipation Thermal Resistance Electrostatic Discharge (ESD) Ratings ESD Ratings for ADA4097-1/ADA4097-2 ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Input Protection Over-The-Top Operation Considerations Output Shutdown Pins (SHDN and SHDNx) Applications Information Large Resistor Gain Operation Recommended Values for Various Gains Noise Distortion Power Dissipation and Thermal Shutdown Circuit Layout Considerations Power Supply Bypassing Grounding ESD Protection when Powered Related Products Typical Applications Outline Dimensions Ordering Guide Evaluation Boards