Datasheet NCP1421 (ON Semiconductor) - 3
| Hersteller | ON Semiconductor |
| Beschreibung | Boost Converter - Sync-Rect, PFM, DC-DC, True-Cutoff, Ring-Killer 600 mA |
| Seiten / Seite | 14 / 3 — NCP1421. PIN FUNCTION DESCRIPTIONS. Pin. Symbol. Description. MAXIMUM … |
| Revision | 7 |
| Dateiformat / Größe | PDF / 273 Kb |
| Dokumentensprache | Englisch |
NCP1421. PIN FUNCTION DESCRIPTIONS. Pin. Symbol. Description. MAXIMUM RATINGS. Rating. Value. Unit. http://onsemi.com
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NCP1421
Textversion des Dokuments
NCP1421 PIN FUNCTION DESCRIPTIONS Pin Symbol Description
1 FB Output Voltage Feedback Input. 2 LBI/EN Low−Battery Detector Input and IC Enable. With this pin pulled down below 0.5 V, the device is disabled and enters the shutdown mode. 3 LBO Open−Drain Low−Battery Detector Output. Output is LOW when VLBI is < 1.20 V. LBO is high impedance in shutdown mode. 4 REF 1.20 V Reference Voltage Output, bypass with 1.0 F capacitor. If this pin is not loaded, bypass with 300 nF capacitor; this pin can be loaded up to 2.5 mA @ VOUT = 3.3 V. 5 BAT Battery input connection for internal ring−killer. 6 GND Ground. 7 LX N−Channel and P−Channel Power MOSFET drain connection. 8 OUT Power Output. OUT also provides bootstrap power to the device.
MAXIMUM RATINGS
(TC = 25°C unless otherwise noted.)
Rating Symbol Value Unit
Power Supply (Pin 8) VOUT −0.3, 5.5 V Input/Output Pins (Pin 1−5, Pin 7) VIO −0.3, 5.5 V Thermal Characteristics Micro8 Plastic Package PD 520 mW Thermal Resistance Junction−to−Air RJA 240 _C/W Operating Junction Temperature Range TJ −40 to +150 _C Operating Ambient Temperature Range TA −40 to +85 _C Storage Temperature Range Tstg −55 to +150 _C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. This device contains ESD protection and exceeds the following tests: Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114. *Except OUT pin, which is 1k V. Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115. *Except OUT pin, which is 100 V. 2. The maximum package power dissipation limit must not be exceeded. TJ(max) * TA PD + RJA 3. Latchup Current Maximum Rating: ±150 mA per JEDEC standard: JESD78. 4. Moisture Sensitivity Level: MSL 1 per IPC/JEDEC standard: J−STD−020A.
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1 FB Output Voltage Feedback Input. 2 LBI/EN Low−Battery Detector Input and IC Enable. With this pin pulled down below 0.5 V, the device is disabled and enters the shutdown mode. 3 LBO Open−Drain Low−Battery Detector Output. Output is LOW when VLBI is < 1.20 V. LBO is high impedance in shutdown mode. 4 REF 1.20 V Reference Voltage Output, bypass with 1.0 F capacitor. If this pin is not loaded, bypass with 300 nF capacitor; this pin can be loaded up to 2.5 mA @ VOUT = 3.3 V. 5 BAT Battery input connection for internal ring−killer. 6 GND Ground. 7 LX N−Channel and P−Channel Power MOSFET drain connection. 8 OUT Power Output. OUT also provides bootstrap power to the device.
MAXIMUM RATINGS
(TC = 25°C unless otherwise noted.)
Rating Symbol Value Unit
Power Supply (Pin 8) VOUT −0.3, 5.5 V Input/Output Pins (Pin 1−5, Pin 7) VIO −0.3, 5.5 V Thermal Characteristics Micro8 Plastic Package PD 520 mW Thermal Resistance Junction−to−Air RJA 240 _C/W Operating Junction Temperature Range TJ −40 to +150 _C Operating Ambient Temperature Range TA −40 to +85 _C Storage Temperature Range Tstg −55 to +150 _C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. This device contains ESD protection and exceeds the following tests: Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114. *Except OUT pin, which is 1k V. Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115. *Except OUT pin, which is 100 V. 2. The maximum package power dissipation limit must not be exceeded. TJ(max) * TA PD + RJA 3. Latchup Current Maximum Rating: ±150 mA per JEDEC standard: JESD78. 4. Moisture Sensitivity Level: MSL 1 per IPC/JEDEC standard: J−STD−020A.
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