Datasheet ADG511, ADG512, ADG513 (Analog Devices) - 5
| Hersteller | Analog Devices |
| Beschreibung | LC2MOS Precision 5 V/3 V Quad SPST Switches |
| Seiten / Seite | 12 / 5 — ADG511/ADG512/ADG513. ABSOLUTE MAXIMUM RATINGS1. CAUTION. WARNING!. ESD … |
| Revision | C |
| Dateiformat / Größe | PDF / 143 Kb |
| Dokumentensprache | Englisch |
ADG511/ADG512/ADG513. ABSOLUTE MAXIMUM RATINGS1. CAUTION. WARNING!. ESD SENSITIVE DEVICE. ORDERING GUIDE. Model1. Temperature Range2
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ADG511/ADG512/ADG513 ABSOLUTE MAXIMUM RATINGS1
Plastic Package, Power Dissipation . 470 mW (TA = +25°C unless otherwise noted) θJA Thermal Impedance . 117°C/W VDD to VSS . 44 V Lead Temperature, Soldering (10 sec) . 260°C VDD to GND . –0.3 V to +25 V SOIC Package, Power Dissipation . 600 mW VSS to GND . +0.3 V to –25 V θJA Thermal Impedance . 77°C/W Analog, Digital Inputs2 . VSS – 2 V to VDD + 2 V or Lead Temperature, Soldering 30 mA, Whichever Occurs First Vapor Phase (60 sec) . 215°C Continuous Current, S or D . 30 mA Infrared (15 sec) . 220°C Peak Current, S or D . 100 mA NOTES (Pulsed at 1 ms, 10% Duty Cycle max) 1Stresses above those listed under Absolute Maximum Ratings may cause perma- Operating Temperature Range nent damage to the device. This is a stress rating only; functional operation of the Industrial (B Version) . –40°C to +85°C device at these or any other conditions above those listed in the operational Extended (T Version) . –55°C to +125°C sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute Storage Temperature Range . –65°C to +150°C maximum rating may be applied at any one time. Junction Temperature . 150°C 2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be Cerdip Package, Power Dissipation . 900 mW limited to the maximum ratings given. θJA Thermal Impedance . 76°C/W Lead Temperature, Soldering (10 sec) . 300°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection.
WARNING!
Although the ADG511/ADG512/ADG513 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss
ESD SENSITIVE DEVICE
of functionality.
ORDERING GUIDE Model1 Temperature Range2 Package Option3
ADG511BN –40°C to +85°C N-16 ADG511BR –40°C to +85°C R-16A ADG511ABR4 –40°C to +85°C R-16A ADG511TQ4 –55°C to +125°C Q-16 ADG512BN –40°C to +85°C N-16 ADG512BR –40°C to +85°C R-16A ADG512ABR4 –40°C to +85°C R-16A ADG513BN –40°C to +85°C N-16 ADG513BR –40°C to +85°C R-16A ADG513ABR4 –40°C to +85°C R-16A NOTES 1For availability of MIL-STD-883, Class B processed parts, contact factory. 23.3 V specifications apply over 0°C to 70°C temperature range. 3N = Plastic DIP; R = 0.15" Small Outline IC (SOIC); Q = Cerdip. 4Trench isolated latch-up proof parts. See Trench Isolation section. REV. C –5–
Plastic Package, Power Dissipation . 470 mW (TA = +25°C unless otherwise noted) θJA Thermal Impedance . 117°C/W VDD to VSS . 44 V Lead Temperature, Soldering (10 sec) . 260°C VDD to GND . –0.3 V to +25 V SOIC Package, Power Dissipation . 600 mW VSS to GND . +0.3 V to –25 V θJA Thermal Impedance . 77°C/W Analog, Digital Inputs2 . VSS – 2 V to VDD + 2 V or Lead Temperature, Soldering 30 mA, Whichever Occurs First Vapor Phase (60 sec) . 215°C Continuous Current, S or D . 30 mA Infrared (15 sec) . 220°C Peak Current, S or D . 100 mA NOTES (Pulsed at 1 ms, 10% Duty Cycle max) 1Stresses above those listed under Absolute Maximum Ratings may cause perma- Operating Temperature Range nent damage to the device. This is a stress rating only; functional operation of the Industrial (B Version) . –40°C to +85°C device at these or any other conditions above those listed in the operational Extended (T Version) . –55°C to +125°C sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute Storage Temperature Range . –65°C to +150°C maximum rating may be applied at any one time. Junction Temperature . 150°C 2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be Cerdip Package, Power Dissipation . 900 mW limited to the maximum ratings given. θJA Thermal Impedance . 76°C/W Lead Temperature, Soldering (10 sec) . 300°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection.
WARNING!
Although the ADG511/ADG512/ADG513 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss
ESD SENSITIVE DEVICE
of functionality.
ORDERING GUIDE Model1 Temperature Range2 Package Option3
ADG511BN –40°C to +85°C N-16 ADG511BR –40°C to +85°C R-16A ADG511ABR4 –40°C to +85°C R-16A ADG511TQ4 –55°C to +125°C Q-16 ADG512BN –40°C to +85°C N-16 ADG512BR –40°C to +85°C R-16A ADG512ABR4 –40°C to +85°C R-16A ADG513BN –40°C to +85°C N-16 ADG513BR –40°C to +85°C R-16A ADG513ABR4 –40°C to +85°C R-16A NOTES 1For availability of MIL-STD-883, Class B processed parts, contact factory. 23.3 V specifications apply over 0°C to 70°C temperature range. 3N = Plastic DIP; R = 0.15" Small Outline IC (SOIC); Q = Cerdip. 4Trench isolated latch-up proof parts. See Trench Isolation section. REV. C –5–