Datasheet ADG5412W (Analog Devices) - 9
| Hersteller | Analog Devices |
| Beschreibung | High Voltage Latch-Up Proof, Quad SPST Switches |
| Seiten / Seite | 20 / 9 — Data Sheet. ADG5412W. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. IN1. … |
| Revision | A |
| Dateiformat / Größe | PDF / 397 Kb |
| Dokumentensprache | Englisch |
Data Sheet. ADG5412W. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. IN1. IN2. S1 1. 12 S2. VSS 4 ADG5412W 13 VDD. SS 2. 11 VDD. TOP VIEW. GND
Modelllinie für dieses Datenblatt
Textversion des Dokuments
Data Sheet ADG5412W PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 1 2 D1 IN IN D2 IN1 1 16 IN2 6 5 4 3 1 1 1 1 D1 2 15 D2 S1 3 14 S2 S1 1 12 S2 VSS 4 ADG5412W 13 VDD V ADG5412W SS 2 11 VDD TOP VIEW TOP VIEW GND 5 12 NC (Not to Scale) GND 3 (Not to Scale) 10 NC S4 6 11 S3 S4 4 9 S3 D4 7 10 D3 5 6 7 8 IN4 8 9 IN3 4 3 D4 D3 NOTES IN IN
002
NOTES 1. NC = NO CONNECT. 1. NC = NO CONNECT.
1695- 1
2. THE EXPOSED PAD IS CONNECTED INTERNALLY.
Figure 2. TSSOP Pin Configuration
FOR INCREASED RELIABILITY OF THE SOLDER JOINTS AND MAXIMUM THERMAL CAPABILITY, IT IS
-003
RECOMMENDED THAT THE PAD BE SOLDERED TO THE SUBSTRATE, V
1695
SS.
1 Figure 3. LFCSP Pin Configuration
Table 7. Pin Function Descriptions Pin No. TSSOP LFCSP Mnemonic Description
1 15 IN1 Logic Control Input 1. 2 16 D1 Drain Terminal 1. This pin can be an input or output. 3 1 S1 Source Terminal 1. This pin can be an input or output. 4 2 VSS Most Negative Power Supply Potential. 5 3 GND Ground (0 V) Reference. 6 4 S4 Source Terminal 4. This pin can be an input or output. 7 5 D4 Drain Terminal 4. This pin can be an input or output. 8 6 IN4 Logic Control Input 4. 9 7 IN3 Logic Control Input 3. 10 8 D3 Drain Terminal 3. This pin can be an input or output. 11 9 S3 Source Terminal 3. This pin can be an input or output. 12 10 NC No Connection. 13 11 VDD Most Positive Power Supply Potential. 14 12 S2 Source Terminal 2. This pin can be an input or output. 15 13 D2 Drain Terminal 2. This pin can be an input or output. 16 14 IN2 Logic Control Input 2. EP Exposed Pad The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 8. ADG5412W Truth Table INx Switch Condition
1 On 0 Off Rev. A | Page 9 of 20 Document Outline Features Applications Functional Block Diagram General Description Product Highlights Table of Contents Revision History Specifications ±15 V Dual Supply ±20 V Dual Supply 12 V Single Supply 36 V Single Supply Continuous Current per Channel, Sx or Dx Absolute Maximum Ratings ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Test Circuits Terminology Applications Information Trench Isolation Outline Dimensions Ordering Guide Automotive Products
002
NOTES 1. NC = NO CONNECT. 1. NC = NO CONNECT.
1695- 1
2. THE EXPOSED PAD IS CONNECTED INTERNALLY.
Figure 2. TSSOP Pin Configuration
FOR INCREASED RELIABILITY OF THE SOLDER JOINTS AND MAXIMUM THERMAL CAPABILITY, IT IS
-003
RECOMMENDED THAT THE PAD BE SOLDERED TO THE SUBSTRATE, V
1695
SS.
1 Figure 3. LFCSP Pin Configuration
Table 7. Pin Function Descriptions Pin No. TSSOP LFCSP Mnemonic Description
1 15 IN1 Logic Control Input 1. 2 16 D1 Drain Terminal 1. This pin can be an input or output. 3 1 S1 Source Terminal 1. This pin can be an input or output. 4 2 VSS Most Negative Power Supply Potential. 5 3 GND Ground (0 V) Reference. 6 4 S4 Source Terminal 4. This pin can be an input or output. 7 5 D4 Drain Terminal 4. This pin can be an input or output. 8 6 IN4 Logic Control Input 4. 9 7 IN3 Logic Control Input 3. 10 8 D3 Drain Terminal 3. This pin can be an input or output. 11 9 S3 Source Terminal 3. This pin can be an input or output. 12 10 NC No Connection. 13 11 VDD Most Positive Power Supply Potential. 14 12 S2 Source Terminal 2. This pin can be an input or output. 15 13 D2 Drain Terminal 2. This pin can be an input or output. 16 14 IN2 Logic Control Input 2. EP Exposed Pad The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 8. ADG5412W Truth Table INx Switch Condition
1 On 0 Off Rev. A | Page 9 of 20 Document Outline Features Applications Functional Block Diagram General Description Product Highlights Table of Contents Revision History Specifications ±15 V Dual Supply ±20 V Dual Supply 12 V Single Supply 36 V Single Supply Continuous Current per Channel, Sx or Dx Absolute Maximum Ratings ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Test Circuits Terminology Applications Information Trench Isolation Outline Dimensions Ordering Guide Automotive Products