Datasheet NXH010P120MNF1PTNG, NXH010P120MNF1PNG (ON Semiconductor) - 5
| Hersteller | ON Semiconductor |
| Beschreibung | F1-2PACK SiC MOSFET Module |
| Seiten / Seite | 12 / 5 — NXH010P120MNF1PTNG, NXH010P120MNF1PNG. ORDERING INFORMATION. Orderable … |
| Revision | P2 |
| Dateiformat / Größe | PDF / 2.2 Mb |
| Dokumentensprache | Englisch |
NXH010P120MNF1PTNG, NXH010P120MNF1PNG. ORDERING INFORMATION. Orderable Part Number. Specific Device Marking. Package Type
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NXH010P120MNF1PTNG, NXH010P120MNF1PNG ORDERING INFORMATION Orderable Part Number Specific Device Marking Package Type Shipping
† NXH010P120MNF1PNG NXH010P120MNF1PNG F1−2PACK: Case 180BW 28 Units / Blister Tray Press−fit Pins (Pb−Free and Halide−Free) NXH010P120MNF1PTNG NXH010P120MNF1PTNG F1−2PACK: Case 180BW 28 Units / Blister Tray Press−fit Pins with pre−applied thermal interface material (TIM) (Pb−Free and Halide−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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† NXH010P120MNF1PNG NXH010P120MNF1PNG F1−2PACK: Case 180BW 28 Units / Blister Tray Press−fit Pins (Pb−Free and Halide−Free) NXH010P120MNF1PTNG NXH010P120MNF1PTNG F1−2PACK: Case 180BW 28 Units / Blister Tray Press−fit Pins with pre−applied thermal interface material (TIM) (Pb−Free and Halide−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
www.onsemi.com 5