Datasheet ADN4624 (Analog Devices) - 3

HerstellerAnalog Devices
Beschreibung5.7 kV RMS, Quad-Channel LVDS 2.5 Gigabit Isolator
Seiten / Seite20 / 3 — ADN4624. SPECIFICATIONS. Table 1. Parameter. Symbol. Min. Typ. Max. Unit. …
Dateiformat / GrößePDF / 3.5 Mb
DokumentenspracheEnglisch

ADN4624. SPECIFICATIONS. Table 1. Parameter. Symbol. Min. Typ. Max. Unit. Test Conditions/Comments. analog.com. Rev. 0 | 3 of 20

ADN4624 SPECIFICATIONS Table 1 Parameter Symbol Min Typ Max Unit Test Conditions/Comments analog.com Rev 0 | 3 of 20

Modelllinie für dieses Datenblatt

Textversion des Dokuments

link to page 14 link to page 4 link to page 14 link to page 4 link to page 14 link to page 4 link to page 3 link to page 3 link to page 14 link to page 14 link to page 14 link to page 14 link to page 14 link to page 14 link to page 3 link to page 14 link to page 3 link to page 3 Data Sheet
ADN4624 SPECIFICATIONS
For all minimum and maximum specifications, VDD1 = VDD2 = 1.7 V to 1.9 V and TA = −40°C to +125°C, unless otherwise noted. For all typical specifications, VDD1 = VDD2 = 1.8 V and TA = 25°C. For all specifications, REFRESH1 = GND1 and REFRESH2 = GND2, unless otherwise noted.
Table 1. Parameter Symbol Min Typ Max Unit Test Conditions/Comments
INPUTS (RECEIVERS) Input Threshold See Figure 28 and Table 2 High VTH 100 mV Low VTL −100 mV Differential Input Voltage |VID| 100 mV See Figure 28 and Table 2 Input Common-Mode Voltage VIC 0.5|VID| 2.4 − 0.5|VID| V See Figure 28 and Table 2 Input Current, High and Low IIH, IIL −5 +5 µA DINx± = 2.4 V or 0 V, other input = 1.2 V, VDDx = 1.8 V or 0 V Differential Input Capacitance1 CINx± 1.7 pF DINx± = 0.4 sin(30 × 106πt) V + 0.5 V, other input = 1.2 V2 LOGIC INPUTS VDDx = VDD1 for REFRESH1, VDDx = VDD2 for REFRESH2 Input High Voltage VINH 0.65 VDDx V Input Low Voltage VINL 0.35 VDDx V Input Current High |IINH| 1 μA REFRESHx = VDDx 25 μA REFRESHx = 1.9 V, VDDx = 0 V Input Current Low |IINL| 16 μA REFRESHx = 0 V OUTPUTS (DRIVERS) Differential Output Voltage |VOD| 250 310 450 mV See Figure 26 and Figure 27, load resistance (RL) = 100 Ω VOD Magnitude Change Δ|VOD| 50 mV See Figure 26 and Figure 27, RL = 100 Ω Offset Voltage VOS 1.125 1.17 1.375 V See Figure 26, RL = 100 Ω VOS Magnitude Change ΔVOS 50 mV See Figure 26, RL = 100 Ω VOS, Peak to Peak1 VOS(PP) 150 mV See Figure 26, RL = 100 Ω Output Short-Circuit Current IOS −20 mA DOUTx± = 0 V 12 mA |VOD| = 0 V Differential Output Capacitance1 COUTx± 5 pF DOUTx± = 0.4 sin(30 × 106πt) V + 0.5 V, other input = 1.2 V, VDD1 or VDD2 = 0 V POWER SUPPLY Supply Current Side 1 IDD1 140 175 mA Frequency (f) = 1.25 GHz Supply Current Side 2 IDD2 115 140 mA f = 1.25 GHz, RL = 100 Ω 95 135 mA f = 1.25 GHz, RL = 100 Ω, REFRESH2 = VDD2 COMMON-MODE TRANSIENT |CM| 40 100 kV/µs Common-mode voltage (VCM) = 1000 V, transient magnitude = IMMUNITY3 800 V 1 These specifications are guaranteed by design and characterization. 2 t denotes time. 3 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining any DOUTx+ or DOUTx− pin in the same state as the corresponding DINx+ or DINx− pin (no change in output) or producing the expected transition on any DOUTx+ or DOUTx− pin if the applied common-mode transient edge is coincident with a data transition on the corresponding DINx+ or DINx− pin. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.
analog.com Rev. 0 | 3 of 20
Document Outline Features Applications Functional Block Diagram General Description Specifications Receiver Input Threshold Test Voltages Timing Specifications Insulation and Safety Related Specifications Package Characteristics Regulatory Information DIN V VDE V 0884-11 (VDE V 0884-11) Insulation Characteristics (Pending) Recommended Operating Conditions Absolute Maximum Ratings Thermal Resistance Electrostatic Discharge (ESD) Ratings ESD Ratings for ADN4624 ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Test Circuits and Switching Characteristics Theory of Operation Isolation and Refresh Truth Table Applications Information PCB Layout Application Examples Magnetic Field Immunity Insulation Lifetime Surface Tracking Insulation Wear Out Calculation and Use of Parameters Example Outline Dimensions Ordering Guide Evaluation Boards