Datasheet MAX17227A (Maxim) - 6

HerstellerMaxim
Beschreibung400mV to 5.5V Input, 2A nanoPower Boost Converter with Short-Circuit Protection and True Shutdown
Seiten / Seite22 / 6 — Absolute Maximum Ratings. Package Information. TDFN. Thermal Resistance, …
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DokumentenspracheEnglisch

Absolute Maximum Ratings. Package Information. TDFN. Thermal Resistance, Four-Layer Board:. WLP. Electrical Characteristics

Absolute Maximum Ratings Package Information TDFN Thermal Resistance, Four-Layer Board: WLP Electrical Characteristics

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Absolute Maximum Ratings
IN, EN, RSEL, OUT to GND ... -0.3V to +6V Continuous Power Dissipation - TDFN (TA = +70°C) (Derate LX RMS Current .. -1.6ARMS to +1.6ARMS 11.7mW/°C above 70°C) ...937.9mW IN RMS Current ... -0.8ARMS to +0.8ARMS Operating Junction Temperature Range...-40°C to +125°C Output Short-Circuit Duration ... Continuous Maximum Junction Temperature ..+150°C Continuous Power Dissipation - WLP (TA = +70°C) (Derate Storage Temperature Range ..-65°C to +150°C 10.51mW/°C above +70°C ) ... 840mW Soldering Temperature (reflow) ..+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information TDFN
Package Code T822+3C Outline Number 21-0168 Land Pattern Number 90-0065
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 85.3°C/W Junction to Case (θJC) 8.9°C/W
WLP
Package Code N60O1+1 Outline Number 21-100390 Land Pattern Number Refer to Application Note 1891
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 95.15°C/W Junction to Case (θJC) N/A For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VIN = 1.5V, RSEL = 191kΩ, VOUT = 3.3V, TJ = -40°C to +125°C, typical values are at TJ = +25°C, CIN = 22μF, COUT = 22μF, unless otherwise noted.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Runs from output after startup, I Minimum Input Voltage V OUT = IN_MIN 400 mV 1mA Guaranteed by LX Maximum On-Time, Input Voltage Range VIN 0.95 5.5 V VOUT > VIN + 150mV while in regulation Minimum Startup Input R V L ≥ 3kΩ, Typical Operating Circuit, TJ = 0.88 0.95 V Voltage IN_START +25°C See Table 1. For V Output Voltage Range V IN < VOUT target. OUT_RANGE 2.3 5.5 V (Note 2) Output Accuracy, LPM VACC_LPM VOUT Falling (Note 3) -1 +1 % www.maximintegrated.com Maxim Integrated | 6 Document Outline General Description Applications Benefits and Features Typical Operating Circuit Absolute Maximum Ratings Package Information TDFN WLP Electrical Characteristics Electrical Characteristics (continued) Typical Operating Characteristics Typical Operating Characteristics (continued) Pin Configurations WLP TDFN Pin Description Functional Diagrams Detailed Description Control Scheme Output Voltage Selection Fixed-Output Voltage Version Features Enable Soft-Start Control Short-Circuit Protection Thermal Shutdown Design Procedure Inductor Selection Input Capacitor Output Capacitor PCB Layout Guidelines Thermal Considerations Ordering Information Revision History