Datasheet HMC8500PM5E (Analog Devices) - 16
| Hersteller | Analog Devices |
| Beschreibung | 10 W (40 dBm), 0.01 GHz to 2.8 GHz, GaN Power Amplifier |
| Seiten / Seite | 17 / 16 — HMC8500PM5E. Data Sheet. EVALUATION BOARD. Table 7. Bill of Materials for … |
| Revision | A |
| Dateiformat / Größe | PDF / 308 Kb |
| Dokumentensprache | Englisch |
HMC8500PM5E. Data Sheet. EVALUATION BOARD. Table 7. Bill of Materials for Evaluation PCB EV1HMC8500PM5. Item. Description
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HMC8500PM5E Data Sheet EVALUATION BOARD
The HMC8500PM5E evaluation board is a 2-layer board fabricated with Rogers 4350 material and using layout techniques recommended for high frequency RF designs. The RF input and RF output traces have a 50 Ω characteristic impedance. The board is attached to a heat sink using an electrically and thermal y conductive epoxy, providing a low thermal and low dc resistance path. Components are mounted using SN63 solder, allowing rework of the surface-mount components without compromising the circuit board to heat sink attachment. The evaluation board and populated components are designed to operate over the ambient temperature range of −40°C to +85°C. During operation, attach the evaluation board to a temperature controlled plate to control the temperature of the HMC8500PM5E during operation. For the proper bias sequence, see the Applications Information section. A fully populated and tested evaluation board, shown in Figure 45, is available from Analog Devices, Inc., upon request. 040 16825- Figure 45. Evaluation PCB
Table 7. Bill of Materials for Evaluation PCB EV1HMC8500PM5 Item Description Manufacturer/Part Number
J2, J3 K connectors SRI/25-146-1000-92 J1 Preform surface terminal strip SAMTEC/TSM-113-01-L-DV C1 0.8 pF capacitor, 0402 package Murata/GRM1555C1HR80BA01D C2 2.2 nF capacitor, 0402 package Samsung/CL05B222KB5NNNC C3, C4, C5 2.2 nF capacitors, 0603 package TDK/C1608C0G1H222J C6, C7, C9, C10 10 μF capacitors, 1210-2 package TDK/C3225X7S1H106K250AB C8 2 pF capacitor, 0402 package AVX/04023U2R0BAT2A C11 4.3 pF capacitor, 0402 package Murata/GJM1552C1H4R3BB01C L1 1.2 nH inductor, 0402 package TDK/MHQ1005P1N2CT000 L2 910 nH inductor, 1008CS package Coilcraft/1008CS-911XGLB L4 3.6 nH inductor, 0603 package Coilcraft/0603CS-3N6XGLU R1 25 Ω high precision resistor, 0603 package Vishay/P0603E25R0BNT R2 10 Ω resistor, 0402 package Panasonic/ERJ-2RKF10R0X Heat Sink Used for thermal transfer from the HMC8500PM5E amplifier Not applicable U1 HMC8500PM5E amplifier Analog Devices/HMC8500PM5E PCB EV1HMC8500PM5 circuit board material: Rogers 4350 Analog Devices/EV1HMC8500PM5 Rev. A | Page 16 of 17 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Total Supply Current by VDD Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Evaluation Board Outline Dimensions Ordering Guide
HMC8500PM5E Data Sheet EVALUATION BOARD
The HMC8500PM5E evaluation board is a 2-layer board fabricated with Rogers 4350 material and using layout techniques recommended for high frequency RF designs. The RF input and RF output traces have a 50 Ω characteristic impedance. The board is attached to a heat sink using an electrically and thermal y conductive epoxy, providing a low thermal and low dc resistance path. Components are mounted using SN63 solder, allowing rework of the surface-mount components without compromising the circuit board to heat sink attachment. The evaluation board and populated components are designed to operate over the ambient temperature range of −40°C to +85°C. During operation, attach the evaluation board to a temperature controlled plate to control the temperature of the HMC8500PM5E during operation. For the proper bias sequence, see the Applications Information section. A fully populated and tested evaluation board, shown in Figure 45, is available from Analog Devices, Inc., upon request. 040 16825- Figure 45. Evaluation PCB
Table 7. Bill of Materials for Evaluation PCB EV1HMC8500PM5 Item Description Manufacturer/Part Number
J2, J3 K connectors SRI/25-146-1000-92 J1 Preform surface terminal strip SAMTEC/TSM-113-01-L-DV C1 0.8 pF capacitor, 0402 package Murata/GRM1555C1HR80BA01D C2 2.2 nF capacitor, 0402 package Samsung/CL05B222KB5NNNC C3, C4, C5 2.2 nF capacitors, 0603 package TDK/C1608C0G1H222J C6, C7, C9, C10 10 μF capacitors, 1210-2 package TDK/C3225X7S1H106K250AB C8 2 pF capacitor, 0402 package AVX/04023U2R0BAT2A C11 4.3 pF capacitor, 0402 package Murata/GJM1552C1H4R3BB01C L1 1.2 nH inductor, 0402 package TDK/MHQ1005P1N2CT000 L2 910 nH inductor, 1008CS package Coilcraft/1008CS-911XGLB L4 3.6 nH inductor, 0603 package Coilcraft/0603CS-3N6XGLU R1 25 Ω high precision resistor, 0603 package Vishay/P0603E25R0BNT R2 10 Ω resistor, 0402 package Panasonic/ERJ-2RKF10R0X Heat Sink Used for thermal transfer from the HMC8500PM5E amplifier Not applicable U1 HMC8500PM5E amplifier Analog Devices/HMC8500PM5E PCB EV1HMC8500PM5 circuit board material: Rogers 4350 Analog Devices/EV1HMC8500PM5 Rev. A | Page 16 of 17 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Total Supply Current by VDD Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Evaluation Board Outline Dimensions Ordering Guide