Datasheet MBRS540, NRVBS540T3G (ON Semiconductor) - 5

HerstellerON Semiconductor
BeschreibungSurface Mount Schottky Power Rectifier
Seiten / Seite7 / 5 — PACKAGE DIMENSIONS. SMC. SCALE 1:1. MILLIMETERS. INCHES. DIM. MIN. NOM. …
Revision10
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DokumentenspracheEnglisch

PACKAGE DIMENSIONS. SMC. SCALE 1:1. MILLIMETERS. INCHES. DIM. MIN. NOM. MAX. GENERIC. MARKING DIAGRAM*. SOLDERING FOOTPRINT*

PACKAGE DIMENSIONS SMC SCALE 1:1 MILLIMETERS INCHES DIM MIN NOM MAX GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT*

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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SMC
CASE 403−03 ISSUE F DATE 02 JUN 2017
SCALE 1:1
NOTES:
HE
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
E
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. 4. 403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03.
MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A
1.90 2.13 2.41 0.075 0.084 0.095
b D A1
0.05 0.10 0.15 0.002 0.004 0.006
b
2.92 3.00 3.07 0.115 0.118 0.121
c
0.15 0.23 0.30 0.006 0.009 0.012
D
5.59 5.84 6.10 0.220 0.230 0.240
E
6.60 6.86 7.11 0.260 0.270 0.280
HE
7.75 7.94 8.13 0.305 0.313 0.320
L
0.76 1.02 1.27 0.030 0.040 0.050
L1
0.51 REF 0.020 REF
A GENERIC MARKING DIAGRAM* c L L1 A1
AYWW AYWW XXXXG XXXXXG
SOLDERING FOOTPRINT*
G G 4.343 XXXXX = Specific Device Code 0.171 A = Assembly Location Y = Year WW = Work Week 3.810 G = Pb−Free Package 0.150 (Note: Microdot may be in either location) *This information is generic. Please refer to 2.794 device data sheet for actual part marking. 0.110 Pb−Free indicator, “G” or microdot “ G”, SCALE 4:1 ǒ mm Ǔ may or may not be present. Some products inches may not follow the Generic Marking. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98ASB42668B
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DESCRIPTION: SMC PAGE 1 OF 1
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