Datasheet SQJ211ELP (Vishay)
| Hersteller | Vishay |
| Beschreibung | Automotive P-Channel 100 V (D-S) 175 °C MOSFET |
| Seiten / Seite | 9 / 1 — SQJ211ELP. Automotive P-Channel 100 V (D-S) 175 °C MOSFET. FEATURES. … |
| Dateiformat / Größe | PDF / 247 Kb |
| Dokumentensprache | Englisch |
SQJ211ELP. Automotive P-Channel 100 V (D-S) 175 °C MOSFET. FEATURES. PowerPAK® SO-8L Single. PRODUCT SUMMARY
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SQJ211ELP
www.vishay.com Vishay Siliconix
Automotive P-Channel 100 V (D-S) 175 °C MOSFET FEATURES PowerPAK® SO-8L Single
• TrenchFET® power MOSFET • AEC-Q101 qualified • 100 % Rg and UIS tested D • Material categorization: for definitions of compliance please see 1 S www.vishay.com/doc?99912 6.15 mm 2 S 3 S 4 1 5.13 mm G S Top View Bottom View
PRODUCT SUMMARY
G VDS (V) -100 RDS(on) () at VGS = -10 V 0.0300 RDS(on) () at VGS = -4.5 V 0.0435 ID (A) -33.6 Configuration Single D P-Channel MOSFET Package PowerPAK SO-8L
ABSOLUTE MAXIMUM RATINGS
(TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-source voltage VDS -100 V Gate-source voltage VGS ± 20 TC = 25 °C -33.6 Continuous drain current ID TC = 125 °C -19.4 Continuous source current (diode conduction) IS -62 A Pulsed drain current a IDM -100 Single pulse avalanche current IAS -42 L = 0.1 mH Single pulse avalanche energy EAS 88 mJ TC = 25 °C 68 Maximum power dissipation a PD W TC = 125 °C 22 Operating junction and storage temperature range TJ, Tstg -55 to +175 °C Soldering recommendations (peak temperature) c, d 260
THERMAL RESISTANCE RATINGS PARAMETER SYMBOL LIMIT UNIT
Junction-to-ambient PCB mount b RthJA 68 °C/W Junction-to-case (drain) RthJC 2.2
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 % b. When mounted on 1" square PCB (FR4 material) c. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components S20-0536-Rev. A, 13-Jul-2020
1
Document Number: 77502 For technical questions, contact: automostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay Siliconix
Automotive P-Channel 100 V (D-S) 175 °C MOSFET FEATURES PowerPAK® SO-8L Single
• TrenchFET® power MOSFET • AEC-Q101 qualified • 100 % Rg and UIS tested D • Material categorization: for definitions of compliance please see 1 S www.vishay.com/doc?99912 6.15 mm 2 S 3 S 4 1 5.13 mm G S Top View Bottom View
PRODUCT SUMMARY
G VDS (V) -100 RDS(on) () at VGS = -10 V 0.0300 RDS(on) () at VGS = -4.5 V 0.0435 ID (A) -33.6 Configuration Single D P-Channel MOSFET Package PowerPAK SO-8L
ABSOLUTE MAXIMUM RATINGS
(TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-source voltage VDS -100 V Gate-source voltage VGS ± 20 TC = 25 °C -33.6 Continuous drain current ID TC = 125 °C -19.4 Continuous source current (diode conduction) IS -62 A Pulsed drain current a IDM -100 Single pulse avalanche current IAS -42 L = 0.1 mH Single pulse avalanche energy EAS 88 mJ TC = 25 °C 68 Maximum power dissipation a PD W TC = 125 °C 22 Operating junction and storage temperature range TJ, Tstg -55 to +175 °C Soldering recommendations (peak temperature) c, d 260
THERMAL RESISTANCE RATINGS PARAMETER SYMBOL LIMIT UNIT
Junction-to-ambient PCB mount b RthJA 68 °C/W Junction-to-case (drain) RthJC 2.2
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 % b. When mounted on 1" square PCB (FR4 material) c. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components S20-0536-Rev. A, 13-Jul-2020
1
Document Number: 77502 For technical questions, contact: automostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000