Datasheet SAM9X60 SIP (Microchip) - 11

SAM9X60 SIP Package and Ballout 6. Package and Ballout 6.1 Packages
The SAM9X60 SIP is available in the packages listed in the following table.
Table 6-1. SAM9X60 SIP Packages Package Name Ball Count Ball Pitch Package Size Memory Type
TFBGA233 233 0.80 mm 14 x 14 mm² DDR2 TFBGA196 196 0.65 mm 11 x 11 mm² SDRAM
6.2 Ballout Figure 6-1. BGA233 Ballout
A GND
PB12
PB2
PB17 PB13
PB19 PB21 PA25 PA22 PA28
DDR
GND
DDRM _VREF
GND
DDRM VDD VSS
B
ADV
GND PB0
REFP PB9 PB10
PB25 PB22 PB24 PA24 PA21
DDRM DDRM DDRM
GND GND
VDD VSS VDD
C
ADV VDD GND PB15 PB11 VDD
PB23
DDR
GND PA29 PA23
DDRM
GND
DDRM DDRM DDRM REFN ANA ANA QSPI _CAL
PD6
VSS VDD VSS VDD
D PB1 PB3
VDD VDD VDD DDRM DDRM DDRM PB6
GND
PB8
PB18 PB20 PA26 PA27 PD8 PD13
CORE CORE IOM VDD VSS VDD
E PB5
PB16
PB4
DDRM DDRM VDD PB14
GND GND GND
DDRM
PD11 PD12 PD10
VDD VDD VSS IOM
F
VDD
GND
PB7
GND GND
DDRM DDRM DDRM
PD14
DDRM IOP0 VSS VSS VDD VSS
G PA13 PA14 PA11 PA12
VDD
GND
DDRM DDRM VDD
PD18 PD19
CORE
PD21
VSS VDD IOM
H PA30 PA31 PA18 PA17 GND GND GND PD15 PD1 PD16 PD17 J PA19 PA16 GND PA20 GND GND GND PD9 GND PD3 PD4 K PA15 PA2 PA3
VDD
GND GND GND PD5 PD20 PD7 PD2
IOP0 VDD VDD
WK L PA4 PA0 PA1 GND GND GND TDI
IOP0
GND
CORE
UP0 PD0 M
VDD
PA10
IOP1
GND GND
VDD CORE
GND GND GND
VDD
GND
NF
GND
VDD
JTAG N PA6 PA9 PA5 RTCK GND GND GND GND PC3 TDO PC3 TMS IN33
IN33
SEL SHDN GND P
HS HS RTU
NRST PA7 PA8 GND PC25 PC19 PC21 PC29 GND IN33 GND
VDD OUT25
TCK PC28
DMC DPC NE
R
HS
PC9 PC7
VDD
GND PC13 PC4 PC17
VDD BU
PC18 GND PC16 GND
IN33
PC26 PC22 GND GND
DMB
T
HS HS
PC3 GND PC11
XOUT
PC2 PC12 PC6 PC10 PC23 PC30 PC20 GND
32 XIN DPA DPB HS
U GND PC14 PC1 PC5 PC15 PC8 PC0
XIN
PC27
XOUT
PC31 PC24 GND GND
32 DMA
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Power Ground Analog Signals © 2020 Microchip Technology Inc.
Datasheet
DS60001580B-page 11 Document Outline Scope Introduction Reference Documents Features Table of Contents 1. DDR2-SDRAM Features 2. SDR-SDRAM Features 3. Configuration Summary 4. Block Diagram 5. Chip Identifier 6. Package and Ballout 6.1. Packages 6.2. Ballout 7. Memories 8. Electrical Characteristics 8.1. Decoupling 8.2. Power Sequences 9. Mechanical Characteristics 9.1. 233-Ball TFBGA 9.2. 196-Ball TFBGA 10. Ordering Information 11. Revision History 11.1. DS60001580B - 02/2020 11.2. DS60001580A - 10/2019 The Microchip Website Product Change Notification Service Customer Support Product Identification System Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service