Datasheet MBN52832 (Murata) - 5

1 Introduction
MBN52832 is a Bluetooth Low Energy module. It enables ultra-low power connectivity for data communication. The product integrates Nordic Bluetooth Low Energy IC, RF front end, and crystal. This is an ideal solution for Internet of Things (IOT) application.
1.1 Features
• Bluetooth® v5 o Higher throughput o Increased broadcast capacity o Improved channel co-existence algorithm (SCA) • ANT, NFC Tag • Nordic nRF52832 Bluetooth Smart® • Built-in ARM Cortex M4 core with 64KB RAM and 512KB flash • Dimension 7.4 x 7.0 x 0.9 mm • Packaging: LGA • Bluetooth/ANT Antenna Configuration: o On-board PCB antenna o Supports external antenna from pin pad • Maximum transmit power: +4dBm @ antenna port (LDO Mode) • Receive sensitivity: -93dBm @ 1Mbps (LDO Mode) • Power consumption o TX 7mA @ 3.5dBm (DCDC Mode) o RX 6mA (DCDC Mode) • Host interface: UART, SPI • Other interfaces: 20 GPIO, 5 ADC, UART, SPI (master and slave), I2C, PWM and Debug SWD • Operating temperature range: -40 ºC to 85 ºC • RoHS compliant • MSL Level 3 in accordance with JEDEC J-STD-020 • Regulatory certificates: FCC, IC, ETSI (plan)
1.2 Applications
• Home Automation • Proximity Services • Building automation • Medical/Healthcare • Beacon Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.4, 02/06/2020 Page 5 of 34
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Document Outline Revision History Table of Contents 1 Introduction 1.1 Features 1.2 Applications 1.3 Block Diagram 1.4 Acronyms 1.5 References 2 Mechanical Specification 2.1 Module Dimensions 2.2 Top and Side View 2.3 PCB Footprint Top View 2.4 Pin Configuration 3 DC Electrical Specification 3.1 Typical Power Consumption 4 RF Specification 5 Environmental Specification 5.1 Absolute Maximum Rating 5.2 Recommended Operating Condition 6 Power Sequence 7 Application Information 7.1 Recommended PCB Landing Pattern 7.2 Host PCB Layout Recommendations 7.3 Layout Guidance for Using Internal PCB Antenna 7.4 Layout Guidance for Microstrip Design And External Antenna 8 Application Reference 9 Assembly Information 10 Packaging and Marking Information 10.1 Dimensions of Tape (Plastic tape) 10.2 Dimensions of Reel 10.3 Taping Diagrams 10.4 Leader and Tail tape 10.5 Peeling Force 10.6 PACKAGE (Humidity proof Packaging) 10.7 Module Marking Information 10.8 Moisture Sensitivity Level 11 Regulatory Information 11.1 FCC Notice (USA) 11.2 FCC Labeling Requirements 11.3 IC Notice (Canada) 11.4 IC Labeling Requirements 11.5 ESTI compliance (Europe) 11.6 RF Exposure 11.6.1 Using on-board PCB antenna 11.6.2 Using external antenna 11.7 KC Certificate Notice 12 RoHS Information 13 Ordering Information 14 Notice 14.1 Storage Conditions 14.2 Handling Conditions 14.3 Standard PCB Design (Land Pattern and Dimensions) 14.4 Notice for Chip Placer 14.5 Operational Environment Conditions 14.6 Input Power Capacity 15 Preconditions To Use Murata Products