Datasheet BM62, BM64 (Microchip) - 10

HerstellerMicrochip
BeschreibungBluetooth Stereo Audio Module
Seiten / Seite74 / 10 — BM62/64. TABLE 1-2:. BM62 MODULE PIN DESCRIPTION (CONTINUED). Pin No. Pin …
Dateiformat / GrößePDF / 7.0 Mb
DokumentenspracheEnglisch

BM62/64. TABLE 1-2:. BM62 MODULE PIN DESCRIPTION (CONTINUED). Pin No. Pin Type. Pin Name. Description. Legend:. Note:. Advanced

BM62/64 TABLE 1-2: BM62 MODULE PIN DESCRIPTION (CONTINUED) Pin No Pin Type Pin Name Description Legend: Note: Advanced

Modelllinie für dieses Datenblatt

Textversion des Dokuments

BM62/64 TABLE 1-2: BM62 MODULE PIN DESCRIPTION (CONTINUED) Pin No Pin Type Pin Name Description
34 I/O P0_5 Configurable control or indication pin (Internally pulled up, if configured as an input) Volume-down key (default), active-low 35 I/O P2_7 Configurable control or indication pin (Internally pulled up, if configured as an input) Volume-up key (default), active-low 36 - NC No connection 37 P GND Ground reference 38 - NC No connection 39 - NC No connection 40 - NC No connection
Legend:
I= Input pin O= Output pin I/O= Input/Output pin P= Power pin
Note:
All I/O pins can be configured using the UI tool, a Windows utility. DS60001403F-Page 10
Advanced
 2017-2020 Microchip Technology Inc. Document Outline Features DSP Audio Processing FIGURE 1: BM62 MODULE FIGURE 2: BM64 MODULE Audio Codec Peripherals RF/Analog HCI Interface MAC/Baseband Processor Operating Condition Compliance Applications Description Table of Contents Most Current Data Sheet Errata Customer Notification System 1.0 Device Overview FIGURE 1-1: SINGLE SPEAKER Application using BM62 Module FIGURE 1-2: SINGLE SPEAKER Application Using BM64 Module FIGURE 1-3: Multi-speaker application USING BM64 Module TABLE 1-1: BM62/64 KEY FEATURES FIGURE 1-4: BM62 Module PIN Diagram TABLE 1-2: BM62 Module PIN Description (Continued) FIGURE 1-5: bm64 Module pin diagram TABLE 1-3: BM64 Module PIN Description (Continued) 2.0 Audio 2.1 Digital Signal Processor FIGURE 2-1: Speech Signal Processing FIGURE 2-2: Audio Signal Processing 2.2 Codec FIGURE 2-3: CODEC DAC Dynamic Range FIGURE 2-4: CODEC DAC THD+N Versus input power FIGURE 2-5: CODEC DAC FREQUENCY RESPONSE (CAPLESS MODE) FIGURE 2-6: CODEC DAC Frequency response (Single-EndED mode) 2.3 Auxiliary Port 2.4 Analog Speaker Output FIGURE 2-7: Analog speaker output Capless MODE FIGURE 2-8: Analog speaker output SINGLE-ENDed MODE 3.0 Transceiver 3.1 Transmitter 3.2 Receiver 3.3 Synthesizer 3.4 Modem 3.5 Adaptive Frequency Hopping (AFH) 4.0 Power Management Unit 4.1 Charging a Battery FIGURE 4-1: BATTERY CHARGING CURVE 4.2 Voltage Monitoring 4.3 LED Drivers FIGURE 4-2: LED Drivers 4.4 Under Voltage Protection (Software Dependent UVP) 4.5 Ambient Detection FIGURE 4-3: Ambient Detection 5.0 Application Information 5.1 Power Supply FIGURE 5-1: Power Tree DIAGRAM 5.2 Host MCU Interface FIGURE 5-2: HOST MCU INTERFACE OVER UART FIGURE 5-3: Power-On/Off Sequence FIGURE 5-4: TIMING SEQUENCE OF RX INDICATION AFTER POWER-ON State FIGURE 5-5: TIMING SEQUENCE OF POWER-OFF State FIGURE 5-6: TIMING SEQUENCE OF POWER-ON (NACK) FIGURE 5-7: RESET TIMING SEQUENCE IN NO RESPONSE FROM MODULE TO HOST MCU FIGURE 5-8: TIMING SEQUENCE OF POWER DROP PROTECTION 5.2.1 Device FW Upgrade (DFU) FIGURE 5-9: Timing Diagram of Application Mode to DFU Mode FIGURE 5-10: Timing Diagram of DFU Mode to Application Mode 5.3 I2S Mode Application FIGURE 5-11: BM64 MODULE IN I2S MASTER MODE FIGURE 5-12: BM64 MODULE IN I2S SLAVE MODE 5.4 Reset 5.5 External Configuration and Programming FIGURE 5-13: EXTERNAL PROGRAMMING HEADER CONNECTIONS TABLE 5-1: SYSTEM CONFIGURATION I/O PIN SETTINGS 5.6 Reference Circuit FIGURE 5-14: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-15: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-16: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-17: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-18: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-19: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-20: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION FIGURE 5-21: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION 6.0 Printed Antenna Information 6.1 Antenna Radiation Pattern FIGURE 6-1: RECOMMENDED KEEPOUT AREA FOR PCB ANTENNA FIGURE 6-2: PCB ANTENNA 3D RADIATION PATTERN at 2441 MHz TABLE 6-1: BM62/64 PCB ANTENNA CHARACTERISTICS 6.2 Module Placement Guidelines FIGURE 6-3: MODULE PLACEMENT GUIDELINES FIGURE 6-4: GND PLANE ON MAIN APPLICATION BOARD 7.0 Physical Dimensions FIGURE 7-1: BM62 Module PCB DIMENSION FIGURE 7-2: BM64 Module PCB DIMENSION FIGURE 7-3: RECOMMENDED BM62 Module PCB FOOTPRINT FIGURE 7-4: RECOMMENDED BM64 Module PCB FOOTPRINT 8.0 Electrical Characteristics TABLE 8-1: RECOMMENDED OPERATING CONDITION TABLE 8-2: I/O AND RESET LEVEL TABLE 8-3: BATTERY CHARGER TABLE 8-4: LED DRIVER TABLE 8-5: AUDIO CODEC ANALOG TO DIGITAL CONVERTER TABLE 8-6: AUDIO CODEC DIGITAL TO ANALOG CONVERTER TABLE 8-7: TRANSMITTER SECTION FOR BDR AND EDR TABLE 8-8: RECEIVER SECTION FOR BDR AND EDR TABLE 8-9: BM62 SYSTEM CURRENT CONSUMPTION TABLE 8-10: BM64SPKS1MC2 EMBEDDED MODE (WITHOUT EXTERNAL MCU) SYSTEM CURRENT CONSUMPTION TABLE 8-11: BM64SPKS1MC2 HOST MCU MODE SYSTEM CURRENT CONSUMPTION 8.1 Timing specifications FIGURE 8-1: TIMING DIAGRAM FOR I2S MODES (MASTER/SLAVE) FIGURE 8-2: TIMING DIAGRAM FOR PCM MODES (MASTER/SLAVE) FIGURE 8-3: AUDIO INTERFACE TIMING Diagram TABLE 8-12: AUDIO INTERFACE TIMING Specifications 9.0 Soldering Recommendations FIGURE 9-1: REFLOW PROFILE 10.0 Ordering Information TABLE 10-1: BM62/64 Module ORDERING INFORMATION Appendix A: Certification Notices TABLE A-1: EUROPEAN COMPLIANCE TESTING (BM62SPKS1MC2/BM62SPKA1MC2) TABLE A-2: EUROPEAN COMPLIANCE TESTING (BM64SPKS1MC1/BM64SPKA1MC1) TABLE A-3: EUROPEAN COMPLIANCE TESTING (BM64SPKS1MC2/BM64SPKA1MC2) Appendix B: Revision History Revision A (May 2016) Revision B (December 2016) TABLE B-1: major Section Updates Revision C (October 2017) TABLE C-1: major Section Updates Revision D (March 2018) TABLE D-1: major Section Updates Revision E (September 2018) TABLE E-1: major Section Updates Revision F (June 2020) TABLE F-1: major Section Updates The Microchip Web Site Customer Change Notification Service Customer Support AMERICAS Corporate Office Atlanta Austin, TX Boston Chicago Dallas Detroit Houston, TX Indianapolis Los Angeles Raleigh, NC New York, NY San Jose, CA Canada - Toronto ASIA/PACIFIC Australia - Sydney China - Beijing China - Chengdu China - Chongqing China - Dongguan China - Guangzhou China - Hangzhou China - Hong Kong SAR China - Nanjing China - Qingdao China - Shanghai China - Shenyang China - Shenzhen China - Suzhou China - Wuhan China - Xian China - Xiamen China - Zhuhai ASIA/PACIFIC India - Bangalore India - New Delhi India - Pune Japan - Osaka Japan - Tokyo Korea - Daegu Korea - Seoul Malaysia - Kuala Lumpur Malaysia - Penang Philippines - Manila Singapore Taiwan - Hsin Chu Taiwan - Kaohsiung Taiwan - Taipei Thailand - Bangkok Vietnam - Ho Chi Minh EUROPE Austria - Wels Denmark - Copenhagen Finland - Espoo France - Paris Germany - Garching Germany - Haan Germany - Heilbronn Germany - Karlsruhe Germany - Munich Germany - Rosenheim Israel - Ra’anana Italy - Milan Italy - Padova Netherlands - Drunen Norway - Trondheim Poland - Warsaw Romania - Bucharest Spain - Madrid Sweden - Gothenberg Sweden - Stockholm UK - Wokingham