Datasheet BM20, BM23 (Microchip) - 6
| Hersteller | Microchip |
| Beschreibung | Bluetooth Stereo Audio Module |
| Seiten / Seite | 54 / 6 — BM20/23. Device Overview. Figure 1-1. BM20 Typical Application. Figure … |
| Dateiformat / Größe | PDF / 2.7 Mb |
| Dokumentensprache | Englisch |
BM20/23. Device Overview. Figure 1-1. BM20 Typical Application. Figure 1-2. BM23 Typical Application. 1.1. Interface Description
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BM20/23 Device Overview 1. Device Overview
The BM20 and BM23 stereo module is built around the IS2020S and IS2023S SoCs, respectively, which integrates the Bluetooth radio transceiver, a Power Management Unit (PMU), and a Digital Signal Processor (DSP). The following figure illustrates a typical example of the BM20 module that operates as an independent system or when connected to an MCU.
Figure 1-1. BM20 Typical Application
The following figure illustrates a typical example of the BM23 module connected to an external MCU and a DSP/ Codec.
Figure 1-2. BM23 Typical Application 1.1 Interface Description
The following figure illustrates the pin diagram of the BM20 module. © 2019 Microchip Technology Inc.
Datasheet
DS70005406B-page 6 Document Outline Introduction Features RF/Analog Audio processor Audio Codec Peripherals Antenna Compliance Operating Conditions Applications Table of Contents 1. Device Overview 1.1. Interface Description 2. Application Information 2.1. Operation with External MCU 2.2. I2S Mode Application 2.3. RESET (RST_N) 2.4. Status LED (LED1, LED2) 2.5. External Configuration 3. Electrical Characteristics 4. Printed Antenna Information 4.1. Module Radiation Pattern 4.2. Module Placement Rules 5. Reference Circuit 5.1. BM20 Reference Circuit 5.2. BM23 Reference circuit 6. Physical Dimensions 7. Reflow Profile 7.1. Soldering Recommendations 7.2. Packing and Storage Information 8. Ordering Information 9. Certification Notices 9.1. United States 9.1.1. Labeling and User Information Requirements 9.1.2. RF Exposure 9.1.3. Helpful Websites 9.2. Canada 9.2.1. Labeling and User Information Requirements 9.2.2. RF Exposure 9.2.3. Helpful Websites 9.3. Europe 9.3.1. Labeling and User Information Requirements 9.3.2. Conformity Assessment 9.3.3. Simplified EU Declaration of Conformity 9.3.4. Helpful Websites 9.4. Japan 9.4.1. Labeling and User Information Requirements 9.4.2. Helpful Websites 9.5. Korea 9.5.1. Labeling and User Information Requirements 9.5.2. Helpful Websites 9.6. Taiwan 9.6.1. Labeling and User information Requirements 9.6.2. Helpful Websites 9.7. China 9.7.1. Labeling and User Information Requirements 9.8. Brazil 9.9. Mexico 9.9.1. Labeling and User Information Requirements 9.10. Argentina 9.10.1. Labeling and User Information Requirements 9.11. Other Regulatory Jurisdictions 10. Document Revision History The Microchip Website Product Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service
The BM20 and BM23 stereo module is built around the IS2020S and IS2023S SoCs, respectively, which integrates the Bluetooth radio transceiver, a Power Management Unit (PMU), and a Digital Signal Processor (DSP). The following figure illustrates a typical example of the BM20 module that operates as an independent system or when connected to an MCU.
Figure 1-1. BM20 Typical Application
The following figure illustrates a typical example of the BM23 module connected to an external MCU and a DSP/ Codec.
Figure 1-2. BM23 Typical Application 1.1 Interface Description
The following figure illustrates the pin diagram of the BM20 module. © 2019 Microchip Technology Inc.
Datasheet
DS70005406B-page 6 Document Outline Introduction Features RF/Analog Audio processor Audio Codec Peripherals Antenna Compliance Operating Conditions Applications Table of Contents 1. Device Overview 1.1. Interface Description 2. Application Information 2.1. Operation with External MCU 2.2. I2S Mode Application 2.3. RESET (RST_N) 2.4. Status LED (LED1, LED2) 2.5. External Configuration 3. Electrical Characteristics 4. Printed Antenna Information 4.1. Module Radiation Pattern 4.2. Module Placement Rules 5. Reference Circuit 5.1. BM20 Reference Circuit 5.2. BM23 Reference circuit 6. Physical Dimensions 7. Reflow Profile 7.1. Soldering Recommendations 7.2. Packing and Storage Information 8. Ordering Information 9. Certification Notices 9.1. United States 9.1.1. Labeling and User Information Requirements 9.1.2. RF Exposure 9.1.3. Helpful Websites 9.2. Canada 9.2.1. Labeling and User Information Requirements 9.2.2. RF Exposure 9.2.3. Helpful Websites 9.3. Europe 9.3.1. Labeling and User Information Requirements 9.3.2. Conformity Assessment 9.3.3. Simplified EU Declaration of Conformity 9.3.4. Helpful Websites 9.4. Japan 9.4.1. Labeling and User Information Requirements 9.4.2. Helpful Websites 9.5. Korea 9.5.1. Labeling and User Information Requirements 9.5.2. Helpful Websites 9.6. Taiwan 9.6.1. Labeling and User information Requirements 9.6.2. Helpful Websites 9.7. China 9.7.1. Labeling and User Information Requirements 9.8. Brazil 9.9. Mexico 9.9.1. Labeling and User Information Requirements 9.10. Argentina 9.10.1. Labeling and User Information Requirements 9.11. Other Regulatory Jurisdictions 10. Document Revision History The Microchip Website Product Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service