Datasheet BM20, BM23 (Microchip)

HerstellerMicrochip
BeschreibungBluetooth Stereo Audio Module
Seiten / Seite54 / 1 — BM20/23. Bluetooth® Stereo Audio Module. Introduction. Note: . Figure …
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DokumentenspracheEnglisch

BM20/23. Bluetooth® Stereo Audio Module. Introduction. Note: . Figure 1. BM20 and BM23 Module. BM20. BM23. Features. Datasheet

Datasheet BM20, BM23 Microchip

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BM20/23 Bluetooth® Stereo Audio Module Introduction
The BM20/23 stereo audio module is a Bluetooth v5.0 (BDR/EDR) audio module for designers to add wireless audio and voice applications to their products. This Bluetooth SIG-certified module provides a complete wireless solution with Bluetooth stack, integrated antenna, and worldwide radio certifications in a compact surface mount package. This stereo module contains a built-in Li-Ion charger and a digital audio interface (BM23). It supports HSP, HFP, SPP, A2DP, and AVRCP profiles. Both AAC and SBC Codecs are supported for A2DP.
Note: 
The customers must connect their own external analog Codec/DSP/amplifier and MCU for audio output.
Figure 1. BM20 and BM23 Module BM20 BM23 Features
• Qualified for Bluetooth v5.0 Specification – HFP v1.6, HSP v1.1, A2DP v1.2, AVRCP v1.5, SPP v1.0, PBAP v1.0 – Bluetooth Classic, Basic Rate/Enhanced Data Rate (BDR/EDR) • On-Board Embedded Bluetooth Stack • Easy to Configure with Windows Graphical User Interface (GUI) or Direct by Microcontroller Unit (MCU) • Compact Surface Mount Module: – 29 x 15 x 2.5 mm – Castellated surface mount pads © 2019 Microchip Technology Inc.
Datasheet
DS70005406B-page 1 Document Outline Introduction Features RF/Analog Audio processor Audio Codec Peripherals Antenna Compliance Operating Conditions Applications Table of Contents 1. Device Overview 1.1. Interface Description 2. Application Information 2.1. Operation with External MCU 2.2. I2S Mode Application 2.3. RESET (RST_N) 2.4. Status LED (LED1, LED2) 2.5. External Configuration 3. Electrical Characteristics 4. Printed Antenna Information 4.1. Module Radiation Pattern 4.2. Module Placement Rules 5. Reference Circuit 5.1. BM20 Reference Circuit 5.2. BM23 Reference circuit 6. Physical Dimensions 7. Reflow Profile 7.1. Soldering Recommendations 7.2. Packing and Storage Information 8. Ordering Information 9. Certification Notices 9.1. United States 9.1.1. Labeling and User Information Requirements 9.1.2. RF Exposure 9.1.3. Helpful Websites 9.2. Canada 9.2.1. Labeling and User Information Requirements 9.2.2. RF Exposure 9.2.3. Helpful Websites 9.3. Europe 9.3.1. Labeling and User Information Requirements 9.3.2. Conformity Assessment 9.3.3. Simplified EU Declaration of Conformity 9.3.4. Helpful Websites 9.4. Japan 9.4.1. Labeling and User Information Requirements 9.4.2. Helpful Websites 9.5. Korea 9.5.1. Labeling and User Information Requirements 9.5.2. Helpful Websites 9.6. Taiwan 9.6.1. Labeling and User information Requirements 9.6.2. Helpful Websites 9.7. China 9.7.1. Labeling and User Information Requirements 9.8. Brazil 9.9. Mexico 9.9.1. Labeling and User Information Requirements 9.10. Argentina 9.10.1. Labeling and User Information Requirements 9.11. Other Regulatory Jurisdictions 10. Document Revision History The Microchip Website Product Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service