Datasheet LTM2884 (Analog Devices) - 2
| Hersteller | Analog Devices |
| Beschreibung | Isolated USB Transceiver with Isolated Power |
| Seiten / Seite | 24 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. … |
| Revision | C |
| Dateiformat / Größe | PDF / 1.3 Mb |
| Dokumentensprache | Englisch |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART MARKING. PACKAGE. MSL. PART NUMBER. PAD OR BALL FINISH
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LTM2884
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
Supply Voltages V TOP VIEW CC to GND .. –0.3V to 18V V 1 2 3 4 5 6 7 8 9 10 11 BUS to GND .. –0.3V to 18V V D1– D1+ SPND- PWR ON VLO GND VBUS VCC CC2 to GND2 ... –0.3V to 10V A VLO to GND .. –0.3V to 4V B VLO2 to GND2 ... –0.3V to 4V C GND ON, SPNDPWR to GND ...–0.3V to (VLO + 0.3V) D1+, D1– to GND .. –0.3V to 5.3V D D2+, D2– to GND2 ... –0.3V to 5.3V E Operating Ambient Temperature Range (Note 3) F LTM2884C ... 0°C to 70°C G LTM2884I ..–40°C to 85°C H LTM2884H ... –40°C to 105°C J GND2 Storage Temperature Range .. –55°C to 125°C K Maximum Internal Operating Temperature .. 125°C L Peak Body Reflow Temperature .. 245°C D2– D2+ GND2 VLO2 GND2 VCC2 BGA PACKAGE 44-LEAD (15mm × 15mm × 5mm) TJMAX = 125°C, PCB = JESD51-9 2s2p: θJA = 18.7°C/W, θJCtop = 16°C/W, θJCbottom = 5.7°C/W, θJB = 5.6°C/W PCB = DC1746A: θJA = 33.5°C/W, θJCtop = 15.7°C/W, θJJCbottom = 6.1°C/W, θJB = 5.3°C/W HEAT FLOW: θJA = NORMAL, θJCtop = 100%, θJCbottom = 100%, θJB = 100% WEIGHT = 2.4g
ORDER INFORMATION PART MARKING PACKAGE MSL PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING TEMPERATURE RANGE
LTM2884CY#PBF 0°C to 70°C LTM2884IY#PBF SAC305 (RoHS) LTM2884Y* e1 BGA 4 –40°C to 85°C LTM2884HY#PBF –40°C to 105°C • Device temperature grade is indicated by a label on the shipping container. * A lower case “a” appearing next to the package pin 1 identifier • Pad or ball finish code is per IPC/JEDEC J-STD-609. indicates a revised version of the LTM2884. All specifications and typical performance curves are applicable to both versions • Recommended BGA PCB Assembly and Manufacturing Procedures. of the LTM2884 unless otherwise noted by LTM2884 or • BGA Package and Tray Drawings LTM2884(a). Rev. C 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Switching Characteristics Isolation Characteristics Regulatory Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Test Circuits Functional Table Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
Supply Voltages V TOP VIEW CC to GND .. –0.3V to 18V V 1 2 3 4 5 6 7 8 9 10 11 BUS to GND .. –0.3V to 18V V D1– D1+ SPND- PWR ON VLO GND VBUS VCC CC2 to GND2 ... –0.3V to 10V A VLO to GND .. –0.3V to 4V B VLO2 to GND2 ... –0.3V to 4V C GND ON, SPNDPWR to GND ...–0.3V to (VLO + 0.3V) D1+, D1– to GND .. –0.3V to 5.3V D D2+, D2– to GND2 ... –0.3V to 5.3V E Operating Ambient Temperature Range (Note 3) F LTM2884C ... 0°C to 70°C G LTM2884I ..–40°C to 85°C H LTM2884H ... –40°C to 105°C J GND2 Storage Temperature Range .. –55°C to 125°C K Maximum Internal Operating Temperature .. 125°C L Peak Body Reflow Temperature .. 245°C D2– D2+ GND2 VLO2 GND2 VCC2 BGA PACKAGE 44-LEAD (15mm × 15mm × 5mm) TJMAX = 125°C, PCB = JESD51-9 2s2p: θJA = 18.7°C/W, θJCtop = 16°C/W, θJCbottom = 5.7°C/W, θJB = 5.6°C/W PCB = DC1746A: θJA = 33.5°C/W, θJCtop = 15.7°C/W, θJJCbottom = 6.1°C/W, θJB = 5.3°C/W HEAT FLOW: θJA = NORMAL, θJCtop = 100%, θJCbottom = 100%, θJB = 100% WEIGHT = 2.4g
ORDER INFORMATION PART MARKING PACKAGE MSL PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING TEMPERATURE RANGE
LTM2884CY#PBF 0°C to 70°C LTM2884IY#PBF SAC305 (RoHS) LTM2884Y* e1 BGA 4 –40°C to 85°C LTM2884HY#PBF –40°C to 105°C • Device temperature grade is indicated by a label on the shipping container. * A lower case “a” appearing next to the package pin 1 identifier • Pad or ball finish code is per IPC/JEDEC J-STD-609. indicates a revised version of the LTM2884. All specifications and typical performance curves are applicable to both versions • Recommended BGA PCB Assembly and Manufacturing Procedures. of the LTM2884 unless otherwise noted by LTM2884 or • BGA Package and Tray Drawings LTM2884(a). Rev. C 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Switching Characteristics Isolation Characteristics Regulatory Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Test Circuits Functional Table Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts