Datasheet THJP (Vishay)
| Hersteller | Vishay |
| Beschreibung | ThermaWick Thermal Jumper Surface Mount Chip |
| Seiten / Seite | 3 / 1 — THJP. ThermaWickTM Thermal Jumper Surface Mount Chip. FEATURES. … |
| Dateiformat / Größe | PDF / 496 Kb |
| Dokumentensprache | Englisch |
THJP. ThermaWickTM Thermal Jumper Surface Mount Chip. FEATURES. ADDITIONAL RESOURCES. APPLICATIONS. D 3. 3 D. CONSTRUCTION
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THJP
www.vishay.com Vishay Dale Thin Film
ThermaWickTM Thermal Jumper Surface Mount Chip FEATURES
• Electrically isolated thermal conductor • High thermal conductivity AlN substrate Available (170 W/m°K) • Electrically isolated terminations Available • Low capacitance • Available with SnPb or lead (Pb)-free wrap terminations Available • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
ADDITIONAL RESOURCES APPLICATIONS D 3 3 D
• Power supplies and converters 3D Models • RF amplifiers THJP surface mount chips are designed to provide an • Synthesizers electrically isolated thermal conductive pathway to a ground plane or heat sink while maintaining the electrical isolation of • Switch mode power supplies the device. The devices are constructed with aluminum • Pin and laser diodes nitride substrates in both SnPb and Pb-free wraparound • Filters termination styles. The low capacitance of the device makes them an excellent choice for high frequency and thermal ladder applications. Custom sizes available.
CONSTRUCTION
Solder coating Nickel termination Aluminum nitride substrate
HEAT TRANSFER DEMONSTRATION
Chip surface temperature was measured using a FLIR SC645 thermal imaging system under ambient conditions. The devices were mounted to an FR4 test card designed with a 25 mm x 19 mm copper heat sink. Power was supplied to device to cause the surface temperature to stabilize at 150 °C. The device was then retested at the same power level with the thermal jumper connecting the device to the heat sink.
Example THJP 1206 Thermal Jumper Showing 36 % Surface Temperature Reduction
Thermal jumper location Ceramic Resistor Chip Without Thermal Jumper (149.8 °C) Ceramic Chip Resistor With Thermal Jumper (95.5 °C) Revision: 18-Dec-2019
1
Document Number: 60157 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay Dale Thin Film
ThermaWickTM Thermal Jumper Surface Mount Chip FEATURES
• Electrically isolated thermal conductor • High thermal conductivity AlN substrate Available (170 W/m°K) • Electrically isolated terminations Available • Low capacitance • Available with SnPb or lead (Pb)-free wrap terminations Available • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
ADDITIONAL RESOURCES APPLICATIONS D 3 3 D
• Power supplies and converters 3D Models • RF amplifiers THJP surface mount chips are designed to provide an • Synthesizers electrically isolated thermal conductive pathway to a ground plane or heat sink while maintaining the electrical isolation of • Switch mode power supplies the device. The devices are constructed with aluminum • Pin and laser diodes nitride substrates in both SnPb and Pb-free wraparound • Filters termination styles. The low capacitance of the device makes them an excellent choice for high frequency and thermal ladder applications. Custom sizes available.
CONSTRUCTION
Solder coating Nickel termination Aluminum nitride substrate
HEAT TRANSFER DEMONSTRATION
Chip surface temperature was measured using a FLIR SC645 thermal imaging system under ambient conditions. The devices were mounted to an FR4 test card designed with a 25 mm x 19 mm copper heat sink. Power was supplied to device to cause the surface temperature to stabilize at 150 °C. The device was then retested at the same power level with the thermal jumper connecting the device to the heat sink.
Example THJP 1206 Thermal Jumper Showing 36 % Surface Temperature Reduction
Thermal jumper location Ceramic Resistor Chip Without Thermal Jumper (149.8 °C) Ceramic Chip Resistor With Thermal Jumper (95.5 °C) Revision: 18-Dec-2019
1
Document Number: 60157 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000