Datasheet BM83 (Microchip) - 15

BM83 Audio Subsystem 3. Audio Subsystem
The input and output audios have different stages and each stage can be programmed to vary the gain response characteristics. For microphone, both single-ended inputs and differential inputs are supported. To maintain a high quality signal, a stable bias voltage source to the condenser microphone’s Field-Effect Transistor (FET) is provided. The DC blocking capacitors can be used at both positive and negative sides of an input. Internally, this analog signal is converted to 16-bit, 8 kHz/16 kHz/44.1 kHz/48 kHz linear PCM data. The following figure shows the audio subsystem.
Figure 3-1. Audio Subsystem RSTGEN
reset
Analog Audio Codec CLKGEN
clk
CPU
registers
DSP
DSP registers AOHPL
DAC
DT0
Audio
AOHPM
Controller DAC
AOHPR ADC_SDATA AIL
ADC Controller
AIR ADC_LRO
Audio
MICN1
ADC
MICP1 DMIC_CLK digmic_mclk_out MICN2 MICP2 DMIC1_L digmic1_l_data_in DMIC1_R digmic1_r_data_in
VREF
MICBIAS
3.1 Digital Signal Processor
The BM83 module integrates a high-performance DSP to provide excellent voice and audio user experience. The advanced speech features, such as AEC and NR are inbuilt. To reduce nonlinear distortion and echo cancellation, an © 2019 Microchip Technology Inc.
Datasheet
DS70005402B-page 15 Document Outline Introduction Features Table of Contents 1. Quick References 1.1. Reference Documentation 1.2. Design Packages 1.3. Acronyms/Abbreviations 2. Device Overview 2.1. BM83 Module Pin Diagram 2.2. BM83 Module Pin Description 3. Audio Subsystem 3.1. Digital Signal Processor 3.2. Codec 3.2.1. DAC Performance 3.2.2. ADC Performance 3.3. Auxiliary Port 3.4. Analog Speaker Output 3.5. Microphone Inputs 4. Bluetooth Transceiver 4.1. Transmitter 4.2. Receiver 4.3. Synthesizer 4.4. Modulator-Demodulator 4.5. Adaptive Frequency Hopping 5. Power Management Unit 5.1. Power Supply 5.2. SAR ADC 5.3. LED Drivers 6. Application Information 6.1. Power On/Off Sequence 6.2. Reset 6.3. Configuring and Programming 6.3.1. Test Mode 6.3.2. 2-wire JTAG Program and Debug 6.3.2.1. Serial Program Clock (TCK_CPU) 6.3.2.2. Serial Program Data (TDI_CPU) 6.4. General Purpose I/O Pins 6.5. I2S Interface 6.6. Host MCU Interface Over UART 7. PCB Antenna Information 7.1. Antenna Radiation Pattern 7.2. Module Placement Guidelines 8. Physical Dimensions 9. Electrical Specifications 9.1. Timing Specifications 10. Soldering Recommendations 11. Ordering Information 12. Appendix A: Regulatory Approval 12.1. United States 12.1.1. Labeling and User Information Requirements 12.1.2. RF Exposure 12.1.3. Helpful Web Sites 12.2. Canada 12.2.1. Labeling and User Information Requirements 12.2.2. RF Exposure 12.2.3. Helpful Web Sites 12.3. Europe 12.3.1. Labeling and User Information Requirements 12.3.2. Conformity Assessment 12.3.2.1. Simplified EU Declaration of Conformity 12.3.3. Helpful Websites 12.4. Japan 12.4.1. Labeling and User Information Requirements 12.4.2. Helpful Web Sites 12.5. Korea 12.5.1. Labeling and User Information Requirements 12.5.2. Helpful Websites 12.6. Taiwan 12.6.1. Labeling and User Information Requirements 12.6.2. Helpful Web Sites 12.7. China 12.7.1. Labeling and User Information Requirements 12.8. Other Regulatory Information 13. Document Revision History The Microchip Website Product Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service