Datasheet LT7101 (Analog Devices) - 37
| Hersteller | Analog Devices |
| Beschreibung | 105V, 1A Low EMI Synchronous Step-Down Regulator with Fast Current Programming |
| Seiten / Seite | 38 / 37 — PACKAGE DESCRIPTION. UHE Package. Variation: UHE36(26). 36-Lead Plastic … |
| Dateiformat / Größe | PDF / 3.2 Mb |
| Dokumentensprache | Englisch |
PACKAGE DESCRIPTION. UHE Package. Variation: UHE36(26). 36-Lead Plastic QFN (5mm. 6mm)
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LT7101
PACKAGE DESCRIPTION UHE Package Variation: UHE36(26) 36-Lead Plastic QFN (5mm
×
6mm)
(Reference LTC DWG # 05-08-1983 Rev Ø) 0.70 ±0.05 5.50 ±0.05 2.60 ±0.05 4.10 ±0.05 PACKAGE 3.00 REF 3.60 OUTLINE ±0.05 0.25 ±0.05 0.50 BSC 5.10 ±0.05 6.50 ±0.05 RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED PIN 1 NOTCH R = 0.30 TYP OR 0.35 × 45° 1.50 REF CHAMFER 5.00 ±0.10 0.00 – 0.05 R = 0.10 TYP 29 30 32 33 34 35 36 0.200 REF 0.40 ±0.10 PIN 1 1.25 REF 28 TOP MARK 1 1.75 REF (SEE NOTE 6) 27 2 3 3.60 4 ±0.10 24 5 6.00 ±0.10 23 6 22 2.60 21 ±0.10 20 19 10 0.8 REF (UHE36(26)) QFN 0714 REV Ø 18 11 0.75 ±0.05 0.25 ±0.05 R = 0.125 TYP 0.50 BSC BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE 2. DRAWING NOT TO SCALE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 3. ALL DIMENSIONS ARE IN MILLIMETERS 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications For more information www.a subject to change without notice. No license is granted by implication or other nalog.com wise under any patent or patent rights of Analog Devices. 37 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Functional Diagram Operation Applications Information Typical Applications Package Description Typical Application Related Parts
PACKAGE DESCRIPTION UHE Package Variation: UHE36(26) 36-Lead Plastic QFN (5mm
×
6mm)
(Reference LTC DWG # 05-08-1983 Rev Ø) 0.70 ±0.05 5.50 ±0.05 2.60 ±0.05 4.10 ±0.05 PACKAGE 3.00 REF 3.60 OUTLINE ±0.05 0.25 ±0.05 0.50 BSC 5.10 ±0.05 6.50 ±0.05 RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED PIN 1 NOTCH R = 0.30 TYP OR 0.35 × 45° 1.50 REF CHAMFER 5.00 ±0.10 0.00 – 0.05 R = 0.10 TYP 29 30 32 33 34 35 36 0.200 REF 0.40 ±0.10 PIN 1 1.25 REF 28 TOP MARK 1 1.75 REF (SEE NOTE 6) 27 2 3 3.60 4 ±0.10 24 5 6.00 ±0.10 23 6 22 2.60 21 ±0.10 20 19 10 0.8 REF (UHE36(26)) QFN 0714 REV Ø 18 11 0.75 ±0.05 0.25 ±0.05 R = 0.125 TYP 0.50 BSC BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE 2. DRAWING NOT TO SCALE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 3. ALL DIMENSIONS ARE IN MILLIMETERS 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications For more information www.a subject to change without notice. No license is granted by implication or other nalog.com wise under any patent or patent rights of Analog Devices. 37 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Functional Diagram Operation Applications Information Typical Applications Package Description Typical Application Related Parts