Datasheet LTM4651 (Analog Devices) - 2
| Hersteller | Analog Devices |
| Beschreibung | EN55022B Compliant 58V, 24W Inverting-Output DC/DC μModule Regulator |
| Seiten / Seite | 36 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1) (All Voltages … |
| Revision | A |
| Dateiformat / Größe | PDF / 2.2 Mb |
| Dokumentensprache | Englisch |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1) (All Voltages Relative to V –. OUT Unless Otherwise Indicated)
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LTM4651
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) (All Voltages Relative to V – OUT Unless Otherwise Indicated)
Terminal Voltages TOP VIEW 1 2 3 4 5 6 7 VIN, VD, SVIN, SW, PGND, GNDSNS, ISETa ..–0.3V to 60V VIN GND, EXTV A CC .. –0.3V to 28V CLKIN NC V RUN ...GND – 0.3V to V – D OUT + 60V B INTV V – CC, PGDFB, VINREG, COMPa .. –0.3V to 4V NC V – OUT SVIN OUT f C SET .. –0.3V to INTVCC COMPb ... –0.3V to 5V PGOOD PGDFB VINREG GND D ISETb .. –0.3V to 28V COMPb COMPa SV – fSET NC OUT CLKIN, PGOOD (Relative to GND) ... –0.3V to 6V E Terminal Currents ISETb ISETa EXTVCC RUN F INTVCC Peak Output Current (Note 8) ..30mA INTVCC TEMP+ ..–1mA to 10mA G – TEMP– ...–10mA to 1mA GNDSNS SVOUT SW H Temperatures TEMP+ TEMP– TEMP+ TEMP– Internal Operating Temperature J V – OUT Range (Notes 2, 7).. –40°C to 125°C K Storage Temperature Range .. –55°C to 125°C PGND NC L Peak Solder Reflow Package Body Temperature .. 245°C BGA PACKAGE 77-PIN (15mm × 9mm × 5.01mm) TJMAX = 125°C θJCtop = 22.4°C/W, θJCbottom = 7.9°C/W, θJB = 9.6°C/W, θJA = 20.8°C/W θ VALUES DETERMINED PER JESD51-12 WEIGHT = 1.8 GRAMS
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4651EY#PBF –40°C to 125°C SAC305 (RoHS) e1 LTM4651IY#PBF LTM4651Y BGA 3 –40°C to 125°C LTM4651IY SnPb (63/37) e0 –40°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev. A 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Test Circuit Decoupling Requirements Operation Applications Information Typical Applications Package Photograph Package Description Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) (All Voltages Relative to V – OUT Unless Otherwise Indicated)
Terminal Voltages TOP VIEW 1 2 3 4 5 6 7 VIN, VD, SVIN, SW, PGND, GNDSNS, ISETa ..–0.3V to 60V VIN GND, EXTV A CC .. –0.3V to 28V CLKIN NC V RUN ...GND – 0.3V to V – D OUT + 60V B INTV V – CC, PGDFB, VINREG, COMPa .. –0.3V to 4V NC V – OUT SVIN OUT f C SET .. –0.3V to INTVCC COMPb ... –0.3V to 5V PGOOD PGDFB VINREG GND D ISETb .. –0.3V to 28V COMPb COMPa SV – fSET NC OUT CLKIN, PGOOD (Relative to GND) ... –0.3V to 6V E Terminal Currents ISETb ISETa EXTVCC RUN F INTVCC Peak Output Current (Note 8) ..30mA INTVCC TEMP+ ..–1mA to 10mA G – TEMP– ...–10mA to 1mA GNDSNS SVOUT SW H Temperatures TEMP+ TEMP– TEMP+ TEMP– Internal Operating Temperature J V – OUT Range (Notes 2, 7).. –40°C to 125°C K Storage Temperature Range .. –55°C to 125°C PGND NC L Peak Solder Reflow Package Body Temperature .. 245°C BGA PACKAGE 77-PIN (15mm × 9mm × 5.01mm) TJMAX = 125°C θJCtop = 22.4°C/W, θJCbottom = 7.9°C/W, θJB = 9.6°C/W, θJA = 20.8°C/W θ VALUES DETERMINED PER JESD51-12 WEIGHT = 1.8 GRAMS
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4651EY#PBF –40°C to 125°C SAC305 (RoHS) e1 LTM4651IY#PBF LTM4651Y BGA 3 –40°C to 125°C LTM4651IY SnPb (63/37) e0 –40°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev. A 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Test Circuit Decoupling Requirements Operation Applications Information Typical Applications Package Photograph Package Description Typical Application Related Parts