Datasheet VM3000 (Vesper) - 6

HerstellerVesper
BeschreibungLow Noise PDM Digital Bottom Port Piezoelectric MEMS Microphone
Seiten / Seite12 / 6 — VM3000. PRELIMINARY DATASHEET. MICROPHONE OPERATION
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DokumentenspracheEnglisch

VM3000. PRELIMINARY DATASHEET. MICROPHONE OPERATION

VM3000 PRELIMINARY DATASHEET MICROPHONE OPERATION

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VM3000
Low Noise PDM Digital Bottom Port Piezoelectric MEMS Microphone
PRELIMINARY DATASHEET MICROPHONE OPERATION
The VM3000 is a Pulse Density Modulated (PDM) digital output microphone. It takes the audio signal from the Piezo MEMS element, amplifies it and samples at a very high rate, converting it to a single-bit stream PDM using a fourth order sigma delta modulator. This PDM data (DATA) is ready to be interfaced directly to a codec, applications processor or other compatible hardware. The master system (codec etc) provides the master clock, CLK which defines the rate at which the bits are transmitted on the DATA line. The data is set on the rising or falling edge of the CLK, defined by the L/R Select pin, with L/R Select=GND (left) setting data on the falling edge, and L/R Select=Vdd (right) setting data on the rising edge. This allows two microphones to be connected to form a stereo configuration over a single DATA line. The CODEC or processor can then separate the bitstreams based on their alignment with the CLK edges. Typical Application Circuit for Mono Micr ophone Configuration (Left Channel Selected) Typical Application Circuit for S tereo Microphone Configuration Document Name: VM3000_Datasheet Page 6 of 12 Vesper reserves the right to alter the datasheet specifications Revision: U0.0.0 without notification. Vesper assumes no liability for the use of engineering samples and offers no warranty for this product. info@vespermems.com Document Outline GENERAL DESCRIPTION FEATURES APPLICATIONS ORDERING INFORMATION BLOCK DIAGRAM TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS SPECIFICATIONS PDM DIGITAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ENVIRONMENTAL ROBUSTNESS RELIABILITY SPECIFCATIONS MICROPHONE OPERATION MICROPHONE MODES TIMING SPECIFICATIONS TYPICAL PERFORMANCE CHARACTERISTICS SOLDER REFLOW PROFILE HANDLING INSTRUCTIONS DIMENSIONS AND PIN LAYOUT PCB DESIGN AND LAND PATTERN LAYOUT TAPE AND REEL SPECIFICATIONS LID MARKING SUPPORTING DOCUMENTS COMPLIANCE INFORMATION CONTACT DETAILS LEGAL INFORMATION REVISION HISTORY