Datasheet AD7689-KGD (Analog Devices) - 10

AD7689-KGD Known Good Die OUTLINE DIMENSIONS 0.25 2.43 SQ 20 5 3 3 2 1 6 19 7 18 8 17 9 16 11 12 13 14 10 15 A TOP VIEW SIDE VIEW (CIRCUIT SIDE) 2017- 0.08 × 0.08 23- 03-
Figure 5. 20-Pad Bare Die [CHIP] (C-20-2) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 7. Die Specifications Parameter Value Unit
Scribe Line Width 80 × 80 µm Die Size (Maximum Size) 2430 × 2430 µm Thickness 250 µm Bond Pads (Minimum Size) 80 × 80 µm Bond Pad Composition 0.5 AlCu % Backside Standard assembly die attach Not applicable Passivation Oxynitride Not applicable Chip Size 2350 × 2350 µm
Table 8. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy adhesive Bonding Method Gold ball1 or aluminum wedge Bonding Sequence Bond pin five first 1 Evaluate the gold wire for suitability before use at elevated temperatures for extended durations.
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD7689-KGD-PT −40°C to +85°C 20-Pad Bare Die [CHIP] C-20-2
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Rev. C | Page 10 of 10 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE