Datasheet LT1936 (Analog Devices) - 19
| Hersteller | Analog Devices |
| Beschreibung | 1.4A, 500kHz Step-Down Switching Regulator |
| Seiten / Seite | 20 / 19 — PACKAGE DESCRIPTION. MS8E Package. 8-Lead Plastic MSOP, Exposed Die Pad. … |
| Dateiformat / Größe | PDF / 306 Kb |
| Dokumentensprache | Englisch |
PACKAGE DESCRIPTION. MS8E Package. 8-Lead Plastic MSOP, Exposed Die Pad. NO MEASUREMENT PURPOSE
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Textversion des Dokuments
LT1936
PACKAGE DESCRIPTION MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev E) BOTTOM VIEW OF EXPOSED PAD OPTION 2.06 ± 0.102 1 (.081 ± .004) 0.29 1.83 ± 0.102 REF 2.794 ± 0.102 0.889 ± 0.127 (.072 ± .004) (.110 ± .004) (.035 ± .005) 0.05 REF 5.23 DETAIL “B” (.206) 2.083 ± 0.102 3.20 – 3.45 CORNER TAIL IS PART OF MIN (.082 ± .004) (.126 – .136) DETAIL “B” THE LEADFRAME FEATURE. FOR REFERENCE ONLY 8
NO MEASUREMENT PURPOSE
3.00 ± 0.102 (.118 0.42 0.65 ± .004) 0.52 ± 0.038 (.0165 ± .0015) (.0256) (NOTE 3) 8 7 6 5 (.0205) TYP BSC REF RECOMMENDED SOLDER PAD LAYOUT 3.00 ± 0.102 4.90 ± 0.152 DETAIL “A” (.118 ± .004) 0.254 (.193 ± .006) (NOTE 4) (.010) 0° – 6° TYP GAUGE PLANE 1 2 3 4 0.53 ± 0.152 (.021 ± .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE 0.22 – 0.38 0.1016 ± 0.0508 (.009 – .015) (.004 ± .002) 0.65 TYP MSOP (MS8E) 0908 REV E (.0256) NOTE: BSC 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 1936fd Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 19
PACKAGE DESCRIPTION MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev E) BOTTOM VIEW OF EXPOSED PAD OPTION 2.06 ± 0.102 1 (.081 ± .004) 0.29 1.83 ± 0.102 REF 2.794 ± 0.102 0.889 ± 0.127 (.072 ± .004) (.110 ± .004) (.035 ± .005) 0.05 REF 5.23 DETAIL “B” (.206) 2.083 ± 0.102 3.20 – 3.45 CORNER TAIL IS PART OF MIN (.082 ± .004) (.126 – .136) DETAIL “B” THE LEADFRAME FEATURE. FOR REFERENCE ONLY 8
NO MEASUREMENT PURPOSE
3.00 ± 0.102 (.118 0.42 0.65 ± .004) 0.52 ± 0.038 (.0165 ± .0015) (.0256) (NOTE 3) 8 7 6 5 (.0205) TYP BSC REF RECOMMENDED SOLDER PAD LAYOUT 3.00 ± 0.102 4.90 ± 0.152 DETAIL “A” (.118 ± .004) 0.254 (.193 ± .006) (NOTE 4) (.010) 0° – 6° TYP GAUGE PLANE 1 2 3 4 0.53 ± 0.152 (.021 ± .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE 0.22 – 0.38 0.1016 ± 0.0508 (.009 – .015) (.004 ± .002) 0.65 TYP MSOP (MS8E) 0908 REV E (.0256) NOTE: BSC 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 1936fd Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 19