Datasheet LTC3407-4 (Analog Devices) - 15
| Hersteller | Analog Devices |
| Beschreibung | Dual Synchronous, 800mA, 2.25MHz Step-Down DC/DC Regulator |
| Seiten / Seite | 16 / 15 — PACKAGE DESCRIPTION. MSE Package. 10-Lead Plastic MSOP, Exposed Die Pad. … |
| Dateiformat / Größe | PDF / 275 Kb |
| Dokumentensprache | Englisch |
PACKAGE DESCRIPTION. MSE Package. 10-Lead Plastic MSOP, Exposed Die Pad. NO MEASUREMENT PURPOSE
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Textversion des Dokuments
LTC3407-4
PACKAGE DESCRIPTION MSE Package 10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev C) BOTTOM VIEW OF EXPOSED PAD OPTION 2.06 p 0.102 2.794 p 0.102 0.889 p 0.127 1 (.110 p .004) (.081 p .004) (.035 p .005) 0.29 1.83 p 0.102 REF (.072 p .004) 5.23 0.05 REF 2.083 p 0.102 3.20 – 3.45 (.206) (.082 p .004) (.126 – .136) DETAIL “B” MIN CORNER TAIL IS PART OF DETAIL “B” THE LEADFRAME FEATURE. FOR REFERENCE ONLY 10
NO MEASUREMENT PURPOSE
0.305 p 0.038 0.50 3.00 p 0.102 (.0120 p .0015) (.0197) (.118 p .004) 0.497 p 0.076 TYP BSC (NOTE 3) (.0196 p .003) RECOMMENDED SOLDER PAD LAYOUT 10 9 8 7 6 REF 3.00 4.90 p 0.152 p 0.102 (.118 (.193 p .006) p .004) (NOTE 4) DETAIL “A” 0.254 (.010) 0o – 6o TYP 1 2 3 4 5 GAUGE PLANE 0.53 p 0.152 1.10 0.86 (.021 p .006) (.043) (.034) MAX REF DETAIL “A” 0.18 (.007) SEATING PLANE 0.17 – 0.27 0.1016 p 0.0508 (.007 – .011) (.004 p .002) 0.50 TYP MSOP (MSE) 0908 REV C (.0197) NOTE: BSC 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 34074fa Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 15
PACKAGE DESCRIPTION MSE Package 10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev C) BOTTOM VIEW OF EXPOSED PAD OPTION 2.06 p 0.102 2.794 p 0.102 0.889 p 0.127 1 (.110 p .004) (.081 p .004) (.035 p .005) 0.29 1.83 p 0.102 REF (.072 p .004) 5.23 0.05 REF 2.083 p 0.102 3.20 – 3.45 (.206) (.082 p .004) (.126 – .136) DETAIL “B” MIN CORNER TAIL IS PART OF DETAIL “B” THE LEADFRAME FEATURE. FOR REFERENCE ONLY 10
NO MEASUREMENT PURPOSE
0.305 p 0.038 0.50 3.00 p 0.102 (.0120 p .0015) (.0197) (.118 p .004) 0.497 p 0.076 TYP BSC (NOTE 3) (.0196 p .003) RECOMMENDED SOLDER PAD LAYOUT 10 9 8 7 6 REF 3.00 4.90 p 0.152 p 0.102 (.118 (.193 p .006) p .004) (NOTE 4) DETAIL “A” 0.254 (.010) 0o – 6o TYP 1 2 3 4 5 GAUGE PLANE 0.53 p 0.152 1.10 0.86 (.021 p .006) (.043) (.034) MAX REF DETAIL “A” 0.18 (.007) SEATING PLANE 0.17 – 0.27 0.1016 p 0.0508 (.007 – .011) (.004 p .002) 0.50 TYP MSOP (MSE) 0908 REV C (.0197) NOTE: BSC 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 34074fa Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 15