Datasheet LTC3407-4 (Analog Devices) - 14

LTC3407-4
PACKAGE DESCRIPTION DD Package 10-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1699 Rev B) 0.70 p0.05 3.55 p0.05 1.65 p0.05 2.15 p0.05 (2 SIDES) PACKAGE OUTLINE 0.25 p 0.05 0.50 BSC 2.38 p0.05 (2 SIDES)
RECOMMENDED
SOLDER PAD PITCH AND DIMENSIONS R = 0.125 0.40 p 0.10 TYP 6 10 3.00 p0.10 1.65 p 0.10 (4 SIDES) (2 SIDES) PIN 1 TOP MARK (SEE NOTE 6) (DD) DFN REV B 0309 5 1 0.200 REF 0.75 p0.05 0.25 p 0.05 0.50 BSC 2.38 p0.10 (2 SIDES) 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 34074fa 14