Datasheet LTC3545, LTC3545-1 (Analog Devices) - 19

LTC3545/LTC3545-1
PACKAGE DESCRIPTION UD Package 16-Lead Plastic QFN (3mm
s
3mm)
(Reference LTC DWG # 05-08-1700 Rev A)
Exposed Pad Variation AA
0.70 p0.05 3.50 p 0.05 1.65 p 0.05 2.10 p 0.05 (4 SIDES) PACKAGE OUTLINE 0.25 p0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS BOTTOM VIEW—EXPOSED PAD R = 0.115 PIN 1 NOTCH R = 0.20 TYP 3.00 p 0.10 0.75 p 0.05 TYP OR 0.25 s 45o CHAMFER (4 SIDES) 15 16 PIN 1 0.40 p 0.10 TOP MARK (NOTE 6) 1 1.65 p 0.10 2 (4-SIDES) (UD16 VAR A) QFN 1207 REV A 0.200 REF 0.25 p 0.05 0.00 – 0.05 0.50 BSC NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-4) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 35451fb Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 19