Datasheet LT1809, LT1810 (Analog Devices) - 22
| Hersteller | Analog Devices |
| Beschreibung | Single/Dual 180MHz, 350V/µs Rail-to-Rail Input and Output Low Distortion Op Amps |
| Seiten / Seite | 24 / 22 — PACKAGE DESCRIPTION. S6 Package. 6-Lead Plastic TSOT-23 |
| Dateiformat / Größe | PDF / 301 Kb |
| Dokumentensprache | Englisch |
PACKAGE DESCRIPTION. S6 Package. 6-Lead Plastic TSOT-23
Modelllinie für dieses Datenblatt
Textversion des Dokuments
LT1809/LT1810
PACKAGE DESCRIPTION S6 Package 6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636 Rev B) 2.90 BSC 0.62 0.95 (NOTE 4) MAX REF 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE ID RECOMMENDED SOLDER PAD LAYOUT 0.30 – 0.45 0.95 BSC PER IPC CALCULATOR 6 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.90 BSC (NOTE 3) S6 TSOT-23 0302 REV B NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 180910fa 22
PACKAGE DESCRIPTION S6 Package 6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636 Rev B) 2.90 BSC 0.62 0.95 (NOTE 4) MAX REF 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE ID RECOMMENDED SOLDER PAD LAYOUT 0.30 – 0.45 0.95 BSC PER IPC CALCULATOR 6 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.90 BSC (NOTE 3) S6 TSOT-23 0302 REV B NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 180910fa 22