Datasheet LT1210 (Analog Devices) - 16
| Hersteller | Analog Devices |
| Beschreibung | 1.1A, 35MHz Current Feedback Amplifier |
| Seiten / Seite | 20 / 16 — PACKAGE DESCRIPTION. Please refer to … |
| Revision | C |
| Dateiformat / Größe | PDF / 1.3 Mb |
| Dokumentensprache | Englisch |
PACKAGE DESCRIPTION. Please refer to http://www.linear.com/product/LT1210#packaging for the most recent package drawings
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LT1210
PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LT1210#packaging for the most recent package drawings. R Package 7-Lead Plastic DD Pak R Package
(Reference LTC DWG # 05-08-1462 Rev G)
7-Lead Plastic DD Pak
(Reference LTC DWG # 05-08-1462 Rev G) 0.25 ±0.02 0.06 ±0.01 (6.350 ±0.508) (1.524 ±0.254) 0.390 – 0.415 0.06 ±0.01 TYP (9.906 – 10.541) 0.165 – 0.180 (1.524 ±0.254) (4.191 – 4.572) 0.045 – 0.055 (1.143 – 1.397) 15° ±5° 0.30 ±0.02 0.06 ±0.01 (7.620 ±0.508) 0.18 ±0.01 (1.524 ±0.254) 0.004 +0.008 –0.004 (4.572 ± 0.254) 0.330 – 0.370 0.06 ±0.01 0.55 ±0.05 (1.524 ±0.254) (8.382 – 9.398) (13.970 ±1.270) TYP (0.102+0.203 –0.102 ) 0.095 – 0.115 0.085 ±0.01 (2.413 – 2.921) (2.159 ±0.254) DETAIL A 0.050 0.050 ±0.012 0.30 ±0.02 0.013 – 0.023 0.143 +0.012 (1.270) (1.270 ±0.305) –0.020 (7.620 ±0.508) BSC (0.330 – 0.584) 0.026 – 0.035 BOTTOM VIEW OF DD PAK 3.632 +0.305 (0.660 – 0.889) ( –0.508) HATCHED AREA IS SOLDER PLATED TYP COPPER HEAT SINK DETAIL A 0° – 7° TYP 0° – 7° TYP 0.420 0.080 0.420 0.276 0.350 0.325 0.205 0.585 0.585 0.320 0.090 0.090 0.050 0.035 0.050 0.035 RECOMMENDED SOLDER PAD LAYOUT RECOMMENDED SOLDER PAD LAYOUT FOR THICKER SOLDER PASTE APPLICATIONS NOTE: R (DD7) 0416 REV G 1. DIMENSIONS IN INCH/(MILLIMETER) 2. DRAWING NOT TO SCALE Rev C 16 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Small-Signal Bandwidth Typical Performance Characteristics Applications Information Typical Applications Simplified Schematic Package Description Revision History Typical Application Related Parts
PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LT1210#packaging for the most recent package drawings. R Package 7-Lead Plastic DD Pak R Package
(Reference LTC DWG # 05-08-1462 Rev G)
7-Lead Plastic DD Pak
(Reference LTC DWG # 05-08-1462 Rev G) 0.25 ±0.02 0.06 ±0.01 (6.350 ±0.508) (1.524 ±0.254) 0.390 – 0.415 0.06 ±0.01 TYP (9.906 – 10.541) 0.165 – 0.180 (1.524 ±0.254) (4.191 – 4.572) 0.045 – 0.055 (1.143 – 1.397) 15° ±5° 0.30 ±0.02 0.06 ±0.01 (7.620 ±0.508) 0.18 ±0.01 (1.524 ±0.254) 0.004 +0.008 –0.004 (4.572 ± 0.254) 0.330 – 0.370 0.06 ±0.01 0.55 ±0.05 (1.524 ±0.254) (8.382 – 9.398) (13.970 ±1.270) TYP (0.102+0.203 –0.102 ) 0.095 – 0.115 0.085 ±0.01 (2.413 – 2.921) (2.159 ±0.254) DETAIL A 0.050 0.050 ±0.012 0.30 ±0.02 0.013 – 0.023 0.143 +0.012 (1.270) (1.270 ±0.305) –0.020 (7.620 ±0.508) BSC (0.330 – 0.584) 0.026 – 0.035 BOTTOM VIEW OF DD PAK 3.632 +0.305 (0.660 – 0.889) ( –0.508) HATCHED AREA IS SOLDER PLATED TYP COPPER HEAT SINK DETAIL A 0° – 7° TYP 0° – 7° TYP 0.420 0.080 0.420 0.276 0.350 0.325 0.205 0.585 0.585 0.320 0.090 0.090 0.050 0.035 0.050 0.035 RECOMMENDED SOLDER PAD LAYOUT RECOMMENDED SOLDER PAD LAYOUT FOR THICKER SOLDER PASTE APPLICATIONS NOTE: R (DD7) 0416 REV G 1. DIMENSIONS IN INCH/(MILLIMETER) 2. DRAWING NOT TO SCALE Rev C 16 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Small-Signal Bandwidth Typical Performance Characteristics Applications Information Typical Applications Simplified Schematic Package Description Revision History Typical Application Related Parts