Datasheet LT3439 (Analog Devices) - 11
| Hersteller | Analog Devices |
| Beschreibung | Slew Rate Controlled Ultralow Noise 1A Isolated DC/DC Transformer Driver |
| Seiten / Seite | 12 / 11 — TYPICAL APPLICATIO. Low Noise 5V to. 12V Push-Pull DC Transformer. … |
| Dateiformat / Größe | PDF / 196 Kb |
| Dokumentensprache | Englisch |
TYPICAL APPLICATIO. Low Noise 5V to. 12V Push-Pull DC Transformer. PACKAGE DESCRIPTIO. FE Package. 16-Lead Plastic TSSOP (4.4mm)
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LT3439
U TYPICAL APPLICATIO Low Noise 5V to
±
12V Push-Pull DC Transformer
OPTIONAL BYP C7 D1 0.01 L1 µF LT1761-BYP VOUT IN OUT 12V 80mA + + + D2 C3 C4 R1 C9 GND ADJ V 47µF 47µF 442k 39µF IN T1 5V 13 C1 • • 4.7µF R2 VIN 49.9k 11 3 SHDN COLA • • LT3439 5 14 D3 SYNC COLB 6 C OPTIONAL T 7 4 R8 BYP C8 D4 RT RSL 10k 0.01 L2 µF LT1964-BYP VOUT CT RT IN OUT –12V 820pF 16.9k GND PGND RSI C10 80mA 16.9k 10 1, 16 C11 C5 C6 R3 GND ADJ + 39µF + + 2.2nF 47µF 47µF 442k C1: TAIYO YUDEN JMK212BJ475KG 1kV C3-C6: SANYO OS-CON 20SVQP47M 3439 TA02 C9, C10: SANYO OS-CON 16SVQPA39M R4 C11: AVX 1206AC222MA11A 49.9k D1-D4: MMBD914 L1, L2: COILCRAFT DT1608C-333 T1: COILTRONICS CTX02-16030
U PACKAGE DESCRIPTIO FE Package 16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BA
4.90 – 5.10* (.193 – .201) 2.74 (.108) 2.74 (.108) 16 1514 13 12 10 11 9 6.60 ±0.10 2.74 (.108) 4.50 ±0.10 SEE NOTE 4 2.74 6.40 (.108) BSC 0.45 ±0.05 1.05 ±0.10 0.65 BSC 1 2 3 4 5 6 7 8 RECOMMENDED SOLDER PAD LAYOUT 1.10 4.30 – 4.50* (.0433) (.169 – .177) MAX 0° – 8° 0.45 – 0.75 0.65 0.09 – 0.20 (.018 – .030) (.0256) 0.05 – 0.15 (.0036 – .0079) BSC (.002 – .006) 0.195 – 0.30 FE16 (BA) TSSOP 0203 (.0077 – .0118) NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE MILLIMETERS FOR EXPOSED PAD ATTACHMENT 2. DIMENSIONS ARE IN (INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE 3. DRAWING NOT TO SCALE sn3439 3439fs Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 11
U TYPICAL APPLICATIO Low Noise 5V to
±
12V Push-Pull DC Transformer
OPTIONAL BYP C7 D1 0.01 L1 µF LT1761-BYP VOUT IN OUT 12V 80mA + + + D2 C3 C4 R1 C9 GND ADJ V 47µF 47µF 442k 39µF IN T1 5V 13 C1 • • 4.7µF R2 VIN 49.9k 11 3 SHDN COLA • • LT3439 5 14 D3 SYNC COLB 6 C OPTIONAL T 7 4 R8 BYP C8 D4 RT RSL 10k 0.01 L2 µF LT1964-BYP VOUT CT RT IN OUT –12V 820pF 16.9k GND PGND RSI C10 80mA 16.9k 10 1, 16 C11 C5 C6 R3 GND ADJ + 39µF + + 2.2nF 47µF 47µF 442k C1: TAIYO YUDEN JMK212BJ475KG 1kV C3-C6: SANYO OS-CON 20SVQP47M 3439 TA02 C9, C10: SANYO OS-CON 16SVQPA39M R4 C11: AVX 1206AC222MA11A 49.9k D1-D4: MMBD914 L1, L2: COILCRAFT DT1608C-333 T1: COILTRONICS CTX02-16030
U PACKAGE DESCRIPTIO FE Package 16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BA
4.90 – 5.10* (.193 – .201) 2.74 (.108) 2.74 (.108) 16 1514 13 12 10 11 9 6.60 ±0.10 2.74 (.108) 4.50 ±0.10 SEE NOTE 4 2.74 6.40 (.108) BSC 0.45 ±0.05 1.05 ±0.10 0.65 BSC 1 2 3 4 5 6 7 8 RECOMMENDED SOLDER PAD LAYOUT 1.10 4.30 – 4.50* (.0433) (.169 – .177) MAX 0° – 8° 0.45 – 0.75 0.65 0.09 – 0.20 (.018 – .030) (.0256) 0.05 – 0.15 (.0036 – .0079) BSC (.002 – .006) 0.195 – 0.30 FE16 (BA) TSSOP 0203 (.0077 – .0118) NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE MILLIMETERS FOR EXPOSED PAD ATTACHMENT 2. DIMENSIONS ARE IN (INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE 3. DRAWING NOT TO SCALE sn3439 3439fs Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 11