Datasheet RH1965MK DICE/DWF (Analog Devices) - 5

RH1965MK DICE/DWF
electrical characteristics Note 8:
GND pin current is tested with VIN = VOUT(NOMINAL) + 1V and a overtemperature protection is active. Continuous operation above the current source load. GND pin current increases slightly in dropout. specified maximum operating junction temperature may impair device
Note 9:
ADJ pin bias current flows into the ADJ pin. reliability.
Note 10:
SHDN pin current flows into the SHDN pin.
Note 14:
Dice are probe tested at 25°C to the limits shown in Table 1.
Note 11:
Reverse-output current is tested with the IN pin grounded and Except for high current tests, dice are tested under low current conditions the OUT pin forced to 1.2V. This current flows into the OUT pin and out of which assure full load current specifications when assembled. the GND pin.
Note 15: Dice that are not qualified by Linear Technology with a can Note 12:
The minimum input voltage specification limits the dropout
sample are guaranteed to meet specifications of Table 1 only. Dice
voltage under some output voltage/load conditions
qualified by Linear Technology with a can sample meet specifications in all tables. Note 13:
This IC includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction
Note 16:
Please refer to the LT1965 standard product data sheet for temperature exceeds the maximum junction temperature when Typical Performance Characteristics, Pin Functions, Applications Information, and Typical Applications.
table 4. post burn-in enDpoints anD Delta limit requirements TA = 25°C ENDPOINT LIMITS DELTA LIMITS PARAMETER CONDITIONS MIN MAX MIN MAX UNITS
ADJ Pin Voltage (Notes 4, 5) VIN = 2.1V, ILOAD = 1mA 1.182 1.218 –0.010 0.010 V ADJ Pin Bias Current (Notes 4, 9) 4.5 –0.4 0.4 μA
table 5. electrical test requirements MIL-STD-883 TEST REQUIREMENTS SUBGROUP PDA Test Notes
Final Electrical Test Requirements (Method 5004) 1*, 2, 3 The PDA is specified as 5% based on failures from group A, subgroup 1, tests after cooldown as the final electrical test in accordance with method Group A Test Requirements (Method 5005) 1, 2, 3 5004 of MIL-STD-883. The verified failures of group A, subgroup 1, after Group B and D for Class S, 1, 2, 3 burn-in divided by the total number of devices submitted for burn-in in End Point Electrical Parameters (Method 5005) that lot shall be used to determine the percent for the lot. *PDA applies to subgroup 1. See PDA Test Notes. Linear Technology Corporation reserves the right to test to tighter limits than those given. rh1965mkf For more information www.linear.com/RH1965MK 5 Document Outline Features Description Dice Pinout Absolute Maximum Ratings Table 1: DICE/DWF Electrical Test Limits Table 2: Electrical Characteristics Table 3: Electrical Characteristics Table 4. Post Burn-In Endpoints and Delta Limit Requirements Table 5. Electrical Test Requirements Total Dose Bias Circuit Burn-In Circuit Typical Performance Characteristics