Datasheet OP284CHIPS (Analog Devices) - 5

Data Sheet OP284CHIPS OUTLINE DIMENSIONS DIE PAD DESCRIPTIONS
Die center is the reference location at 0.0 μm × 0.0 μm. Pad coordinates are to the center of each pad. Waffle pack orientation is the chamfer corner to the OUTA pad.
Table 4. Pad Mnemonics, Function Descriptions, and Coordinates Mnemonic Description Pad Coordinates (μm)
OUTA Output of Channel A. −660 × +780 −INA Negative Input Channel A. −608 × +149 +INA Positive Input Channel A. −608 × −107 V− Pad Negative Power Supply. Substrate is connected to V−.

−662 × −780 +INB Positive Input Channel B. +590 × −800 −INB Negative Input Channel B. +586 × −424 OUTB Output Channel B. 570 × 437 V+ Positive Power Supply. 590 × 802 NC No Connect—Factory Use Only. −664 × −490 NC No Connect—Factory Use Only. 524 × 0
ORDERING GUIDE Model Functional Temperature Range Package Option/Count Package Option
OP284CHIPS −40°C to +125°C Waffle Pack/221 DIE
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Rev. A | Page 5 of 5 Document Outline FEATURES GENERAL DESCRIPTION OP284 CHIP DIMENSIONS AND PAD LAYOUT TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS, VSY = ±15.0 V ABSOLUTE MAXIMUM RATINGS ESD CAUTION OUTLINE DIMENSIONS DIE PAD DESCRIPTIONS ORDERING GUIDE