Datasheet LTC3025 (Analog Devices) - 10

LTC3025
PACKAGE DESCRIPTION DC Package 6-Lead Plastic DFN (2mm
×
2mm)
(Reference LTC DWG # 05-08-1703 Rev B) 0.70 p0.05 2.55 p0.05 0.61 p0.05 1.15 p0.05 (2 SIDES) PACKAGE OUTLINE 0.25 p 0.05 0.50 BSC 1.42 p0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS R = 0.125 0.40 p 0.10 TYP 0.56 p 0.05 4 6 (2 SIDES) 2.00 p0.10 PIN 1 NOTCH (4 SIDES) PIN 1 BAR R = 0.20 OR TOP MARK 0.25 s 45o (SEE NOTE 6) CHAMFER R = 0.05 (DC6) DFN REV B 1309 TYP 3 1 0.25 p 0.05 0.200 REF 0.75 p0.05 0.50 BSC 1.37 p0.05 (2 SIDES) 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 3025fd 10