LT1761 Series PACKAGE DESCRIPTIONS5 Package5-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1635) 0.62 0.95 2.90 BSC MAX REF (NOTE 4) 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE RECOMMENDED SOLDER PAD LAYOUT 0.30 – 0.45 TYP 0.95 BSC PER IPC CALCULATOR 5 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.90 BSC NOTE: (NOTE 3) S5 TSOT-23 0302 REV B 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 1761sff 20 Document Outline FEATURES DESCRIPTION APPLICATIONS TYPICAL APPLICATION ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION ORDER INFORMATION ELECTRICAL CHARACTERISTICS TYPICAL PERFORMANCE CHARACTERISTICS PIN FUNCTIONS APPLICATIONS INFORMATION PACKAGE DESCRIPTION REVISION HISTORY TYPICAL APPLICATION RELATED PARTS