Datasheet LTC2360, LTC2361, LTC2362 (Analog Devices) - 19

HerstellerAnalog Devices
Beschreibung500ksps, 12-Bit Serial ADCs in TSOT-23
Seiten / Seite20 / 19 — PACKAGE DESCRIPTION. S6 Package. 6-Lead Plastic TSOT-23. TS8 Package. …
Dateiformat / GrößePDF / 325 Kb
DokumentenspracheEnglisch

PACKAGE DESCRIPTION. S6 Package. 6-Lead Plastic TSOT-23. TS8 Package. 8-Lead Plastic TSOT-23

PACKAGE DESCRIPTION S6 Package 6-Lead Plastic TSOT-23 TS8 Package 8-Lead Plastic TSOT-23

Modelllinie für dieses Datenblatt

LTC2360
LTC2361
LTC2362

Textversion des Dokuments

LTC2360/LTC2361/LTC2362
PACKAGE DESCRIPTION S6 Package 6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636) 2.90 BSC 0.62 0.95 (NOTE 4) MAX REF 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE ID RECOMMENDED SOLDER PAD LAYOUT 0.30 – 0.45 0.95 BSC PER IPC CALCULATOR 6 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.90 BSC (NOTE 3) S6 TSOT-23 0302 REV B NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 2. DRAWING NOT TO SCALE 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 3. DIMENSIONS ARE INCLUSIVE OF PLATING 6. JEDEC PACKAGE REFERENCE IS MO-193
TS8 Package 8-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1637) 2.90 BSC 0.52 0.65 (NOTE 4) MAX REF 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE ID RECOMMENDED SOLDER PAD LAYOUT 0.22 – 0.36 0.65 BSC PER IPC CALCULATOR 8 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.95 BSC (NOTE 3) TS8 TSOT-23 0802 NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 2. DRAWING NOT TO SCALE 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 3. DIMENSIONS ARE INCLUSIVE OF PLATING 6. JEDEC PACKAGE REFERENCE IS MO-193 236012fa Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 19