Datasheet AD8605, AD8606, AD8608 (Analog Devices) - 23
| Hersteller | Analog Devices |
| Beschreibung | Low Noise, CMOS, Rail-to-Rail, Input/Output Precision Quad Op Amp |
| Seiten / Seite | 24 / 23 — Data Sheet. AD8605/AD8606/AD8608. 1.480 1.430 1.380. BALL A1. IDENTIFIER. … |
| Revision | O |
| Dateiformat / Größe | PDF / 850 Kb |
| Dokumentensprache | Englisch |
Data Sheet. AD8605/AD8606/AD8608. 1.480 1.430 1.380. BALL A1. IDENTIFIER. 1.825 1.775. 1.00. 1.725. REF. 0.50. BSC. TOP VIEW. BOTTOM VIEW
Modelllinie für dieses Datenblatt
AD8606
Textversion des Dokuments
Data Sheet AD8605/AD8606/AD8608 1.480 1.430 1.380 3 2 1 A BALL A1 IDENTIFIER 1.825 1.775 1.00 1.725 REF B C 0.50 BSC TOP VIEW BOTTOM VIEW (BALL SIDE DOWN) (BALL SIDE UP) 0.380 0.675 0.355 0.595 SIDE VIEW 0.330 0.515 COPLANARITY 0.05 0.27 SEATING 0.340 A 0.24 PLANE 0.320 0.21 2012- 0.300 10- 08-
Figure 62. 8-Ball Wafer Level Chip Scale Package [WLCSP] (CB-8-1) Dimensions shown in millimeters
8.75 (0.3445) 8.55 (0.3366) 14 8 4.00 (0.1575) 6.20 (0.2441) 1 3.80 (0.1496) 7 5.80 (0.2283) 1.27 (0.0500) 0.50 (0.0197) BSC 45° 1.75 (0.0689) 0.25 (0.0098) 0.25 (0.0098) 1.35 (0.0531) 8° 0.10 (0.0039) 0° COPLANARITY SEATING 0.10 0.51 (0.0201) 1.27 (0.0500) PLANE 0.25 (0.0098) 0.31 (0.0122) 0.40 (0.0157) 0.17 (0.0067) COMPLIANT TO JEDEC STANDARDS MS-012-AB CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS A (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 060606-
Figure 63. 14-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-14) Dimensions shown in millimeters and (inches) Rev. N | Page 23 of 24 Document Outline Features Applications General Description Pin Configurations Revision History 5 V Electrical Specifications 2.7 V Electrical Specifications Absolute Maximum Ratings ESD Caution Typical Performance Characteristics Applications Information Output Phase Reversal Maximum Power Dissipation Input Overvoltage Protection THD + Noise Total Noise Including Source Resistors Channel Separation Capacitive Load Drive Light Sensitivity WLCSP Assembly Considerations I-V Conversion Applications Photodiode Preamplifier Applications Audio and PDA Applications Instrumentation Amplifiers DAC Conversion Outline Dimensions Ordering Guide
Figure 62. 8-Ball Wafer Level Chip Scale Package [WLCSP] (CB-8-1) Dimensions shown in millimeters
8.75 (0.3445) 8.55 (0.3366) 14 8 4.00 (0.1575) 6.20 (0.2441) 1 3.80 (0.1496) 7 5.80 (0.2283) 1.27 (0.0500) 0.50 (0.0197) BSC 45° 1.75 (0.0689) 0.25 (0.0098) 0.25 (0.0098) 1.35 (0.0531) 8° 0.10 (0.0039) 0° COPLANARITY SEATING 0.10 0.51 (0.0201) 1.27 (0.0500) PLANE 0.25 (0.0098) 0.31 (0.0122) 0.40 (0.0157) 0.17 (0.0067) COMPLIANT TO JEDEC STANDARDS MS-012-AB CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS A (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 060606-
Figure 63. 14-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-14) Dimensions shown in millimeters and (inches) Rev. N | Page 23 of 24 Document Outline Features Applications General Description Pin Configurations Revision History 5 V Electrical Specifications 2.7 V Electrical Specifications Absolute Maximum Ratings ESD Caution Typical Performance Characteristics Applications Information Output Phase Reversal Maximum Power Dissipation Input Overvoltage Protection THD + Noise Total Noise Including Source Resistors Channel Separation Capacitive Load Drive Light Sensitivity WLCSP Assembly Considerations I-V Conversion Applications Photodiode Preamplifier Applications Audio and PDA Applications Instrumentation Amplifiers DAC Conversion Outline Dimensions Ordering Guide