Datasheet MCP601, MCP601R, MCP602, MCP603, MCP604 (Microchip)

MCP601/1R/2/3/4 2.7V to 6.0V Single Supply CMOS Op Amps Features Description
• Single-Supply: 2.7V to 6.0V The Microchip Technology Inc. MCP601/1R/2/3/4 • Rail-to-Rail Output family of low-power operational amplifiers (op amps) • Input Range Includes Ground are offered in single (MCP601), single with Chip Select (CS) (MCP603), dual (MCP602), and quad (MCP604) • Gain Bandwidth Product: 2.8 MHz (typical) configurations. These op amps utilize an advanced • Unity-Gain Stable CMOS technology that provides low bias current, high- • Low Quiescent Current: 230 µA/amplifier (typical) speed operation, high open-loop gain, and rail-to-rail • Chip Select (CS):
MCP603 only
output swing. This product offering operates with a • Temperature Ranges: single supply voltage that can be as low as 2.7V, while drawing 230 µA (typical) of quiescent current per - Industrial: -40°C to +85°C amplifier. In addition, the common mode input voltage - Extended: -40°C to +125°C range goes 0.3V below ground, making these • Available in Single, Dual, and Quad amplifiers ideal for single-supply operation.
Typical Applications
These devices are appropriate for low power, battery operated circuits due to the low quiescent current, for • Portable Equipment A/D convert driver amplifiers because of their wide bandwidth or for anti-aliasing filters by virtue of their low • A/D Converter Driver input bias current. • Photo Diode Pre-amp The MCP601, MCP602, and MCP603 are available in • Analog Filters standard 8-lead PDIP, SOIC, and TSSOP packages. • Data Acquisition The MCP601 and MCP601R are also available in a • Notebooks and PDAs standard 5-lead SOT-23 package, while the MCP603 is • Sensor Interface available in a standard 6-lead SOT-23 package. The MCP604 is offered in standard 14-lead PDIP, SOIC,
Available Tools
and TSSOP packages. The MCP601/1R/2/3/4 family is available in the • SPICE Macro Models Industrial and Extended temperature ranges and has a • FilterLab® Software power supply range of 2.7V to 6.0V. • Mindi™ Simulation Tool • MAPS (Microchip Advanced Part Selector) • Analog Demonstration and Evaluation Boards • Application Notes
Package Types MCP601 MCP602 MCP603 MCP604 PDIP, SOIC, TSSOP PDIP, SOIC, TSSOP PDIP, SOIC, TSSOP PDIP, SOIC, TSSOP
NC 1 8 NC VOUTA 1 V NC V 8 1 8 CS OUTA 1 14 V DD OUTD VIN– 2 7 VDD V 2 7 V V 2 7 V V INA– OUTB IN– DD INA– 2 13 VIND– VIN+ 3 6 V V 3 6 V V V OUT INA+ IN+ 3 6 V INA+ 3 12 V INB– OUT IND+ VSS 4 5 NC V V V SS 4 5 V SS 4 5 DD NC 4 11 V INB+ SS VINB+ 5 10 VINC+
MCP601 MCP601R MCP603
VINB– 6 9 VINC–
SOT23-5 SOT23-5 SOT23-6
VOUTB 7 8 V V VOUT 1 V V OUTC OUT 1 5 VDD 5 SS OUT 1 6 VDD VSS 2 V 2 V DD SS 2 5 CS VIN+ 3 4 V V 3 4 V V IN– IN+ IN+ 3 4 V IN– IN– © 2007 Microchip Technology Inc. DS21314G-page 1 Document Outline 1.0 Electrical Characteristics FIGURE 1-1: MCP603 Chip Select (CS) Timing Diagram. 1.1 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2.0 Typical Performance Curves FIGURE 2-1: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-2: Slew Rate vs. Temperature. FIGURE 2-3: Gain Bandwidth Product, Phase Margin vs. Temperature. FIGURE 2-4: Quiescent Current vs. Supply Voltage. FIGURE 2-5: Quiescent Current vs. Temperature. FIGURE 2-6: Input Noise Voltage Density vs. Frequency. FIGURE 2-7: Input Offset Voltage. FIGURE 2-8: Input Offset Voltage vs. Temperature. FIGURE 2-9: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 2.7V. FIGURE 2-10: Input Offset Voltage Drift. FIGURE 2-11: CMRR, PSRR vs. Temperature. FIGURE 2-12: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 5.5V. FIGURE 2-13: Channel-to-Channel Separation vs. Frequency. FIGURE 2-14: Input Bias Current, Input Offset Current vs. Ambient Temperature. FIGURE 2-15: DC Open-Loop Gain vs. Load Resistance. FIGURE 2-16: CMRR, PSRR vs. Frequency. FIGURE 2-17: Input Bias Current, Input Offset Current vs. Common Mode Input Voltage. FIGURE 2-18: DC Open-Loop Gain vs. Supply Voltage. FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Load Resistance. FIGURE 2-20: Output Voltage Headroom vs. Output Current. FIGURE 2-21: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-22: DC Open-Loop Gain vs. Temperature. FIGURE 2-23: Output Voltage Headroom vs. Temperature. FIGURE 2-24: Output Short-Circuit Current vs. Supply Voltage. FIGURE 2-25: Large Signal Non-Inverting Pulse Response. FIGURE 2-26: Small Signal Non-Inverting Pulse Response. FIGURE 2-27: Chip Select Timing (MCP603). FIGURE 2-28: Large Signal Inverting Pulse Response. FIGURE 2-29: Small Signal Inverting Pulse Response. FIGURE 2-30: Quiescent Current Through VSS vs. Chip Select Voltage (MCP603). FIGURE 2-31: Chip Select Pin Input Current vs. Chip Select Voltage. FIGURE 2-32: Hysteresis of Chip Select’s Internal Switch. FIGURE 2-33: The MCP601/1R/2/3/4 family of op amps shows no phase reversal under input overdrive. FIGURE 2-34: Measured Input Current vs. Input Voltage (below VSS). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table For Single Op Amps TABLE 3-2: Pin Function Table For Dual And Quad Op Amps 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Chip Select Digital Input 3.4 Power Supply Pins 4.0 Applications Information 4.1 Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Unity Gain Buffer has a Limited VOUT Range. 4.2 Rail-to-Rail Output 4.3 MCP603 Chip Select 4.4 Capacitive Loads FIGURE 4-4: Output resistor RISO stabilizes large capacitive loads. FIGURE 4-5: Recommended RISO values for capacitive loads. 4.5 Supply Bypass 4.6 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.7 PCB Surface Leakage FIGURE 4-7: Example Guard Ring layout. 4.8 Typical Applications FIGURE 4-8: Second-Order, Low-Pass Sallen-Key Filter. FIGURE 4-9: Second-Order, Low-Pass Multiple-Feedback Filter. FIGURE 4-10: Three-Op Amp Instrumentation Amplifier. FIGURE 4-11: Two-Op Amp Instrumentation Amplifier. FIGURE 4-12: Photovoltaic Mode Detector. FIGURE 4-13: Photoconductive Mode Detector. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Mindi™ Simulatior Tool 5.4 MAPS (Microchip Advanced Part Selector) 5.5 Analog Demonstration and Evaluation Boards 5.6 Application Notes 6.0 Packaging Information 6.1 Package Marking Information