Datasheet MPU-6000, MPU-6050 - 46
| Beschreibung | MPU-60X0 is the world's first integrated 6-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, and a Digital Motion ProcessorTM (DMP) all in a small 4x4x0.9mm package |
| Seiten / Seite | 52 / 46 — MPU-6000/MPU-6050 Product Specification. Temperature Set Points … |
| Revision | 3.4 |
| Dateiformat / Größe | PDF / 1.6 Mb |
| Dokumentensprache | Englisch |
MPU-6000/MPU-6050 Product Specification. Temperature Set Points Corresponding to Reflow Profile Above. CONSTRAINTS
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Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification
Revision: 3.4 Release Date: 08/19/2013
Temperature Set Points Corresponding to Reflow Profile Above CONSTRAINTS Step Setting Temp (°C) Time (sec) Max. Rate (°C/sec) A
Troom 25
B
TSmin 150
C
TSmax 200 60 < tBC < 120
D
TLiquidus 217 r(TLiquidus-TPmax) < 3
E
TPmin [255°C, 260°C] 255 r(TLiquidus-TPmax) < 3
F
TPmax [ 260°C, 265°C] 260 tAF < 480 r(TLiquidus-TPmax) < 3
G
TPmin [255°C, 260°C] 255 10< tEG < 30 r(TPmax-TLiquidus) < 4
H
TLiquidus 217 60 < tDH < 120
I
Troom 25
Notes:
Customers must never exceed the Classification temperature (TPmax = 260°C). All temperatures refer to the topside of the QFN package, as measured on the package body surface.
Production Reflow:
Check the recommendations of your solder manufacturer. For optimum results, use lead-free solders that have lower specified temperature profiles (Tpmax ~ 235°C). Also use lower ramp-up and ramp-down rates than those used in the qualification profile. Never exceed the maximum conditions that we used for qualification, as these represent the maximum tolerable ratings for the device.
11.5 Storage Specifications
The storage specification of the MPU-60X0 conforms to IPC/JEDEC J-STD-020D.1 Moisture Sensitivity Level (MSL) 3. Calculated shelf-life in moisture-sealed bag 12 months -- Storage conditions: <40°C and <90% RH After opening moisture-sealed bag 168 hours -- Storage conditions: ambient ≤30°C at 60%RH
11.6 Package Marking Specification TOP VIEW TOP VIEW
INVENSENSE INVENSENSE Part number MPU6000 MPU6050 Lot traceability code X X X X X X-X X X X X X X X-X X X X Y Y W W X X X Y Y W W X Foundry code Rev Code Y Package Vendor Code Y = Year Code W W = Work Week
Package Marking Specification
46 of 52
MPU-6000/MPU-6050 Product Specification
Revision: 3.4 Release Date: 08/19/2013
Temperature Set Points Corresponding to Reflow Profile Above CONSTRAINTS Step Setting Temp (°C) Time (sec) Max. Rate (°C/sec) A
Troom 25
B
TSmin 150
C
TSmax 200 60 < tBC < 120
D
TLiquidus 217 r(TLiquidus-TPmax) < 3
E
TPmin [255°C, 260°C] 255 r(TLiquidus-TPmax) < 3
F
TPmax [ 260°C, 265°C] 260 tAF < 480 r(TLiquidus-TPmax) < 3
G
TPmin [255°C, 260°C] 255 10< tEG < 30 r(TPmax-TLiquidus) < 4
H
TLiquidus 217 60 < tDH < 120
I
Troom 25
Notes:
Customers must never exceed the Classification temperature (TPmax = 260°C). All temperatures refer to the topside of the QFN package, as measured on the package body surface.
Production Reflow:
Check the recommendations of your solder manufacturer. For optimum results, use lead-free solders that have lower specified temperature profiles (Tpmax ~ 235°C). Also use lower ramp-up and ramp-down rates than those used in the qualification profile. Never exceed the maximum conditions that we used for qualification, as these represent the maximum tolerable ratings for the device.
11.5 Storage Specifications
The storage specification of the MPU-60X0 conforms to IPC/JEDEC J-STD-020D.1 Moisture Sensitivity Level (MSL) 3. Calculated shelf-life in moisture-sealed bag 12 months -- Storage conditions: <40°C and <90% RH After opening moisture-sealed bag 168 hours -- Storage conditions: ambient ≤30°C at 60%RH
11.6 Package Marking Specification TOP VIEW TOP VIEW
INVENSENSE INVENSENSE Part number MPU6000 MPU6050 Lot traceability code X X X X X X-X X X X X X X X-X X X X Y Y W W X X X Y Y W W X Foundry code Rev Code Y Package Vendor Code Y = Year Code W W = Work Week
Package Marking Specification
46 of 52