Package Linear Technology TSSOP-28 — Datenblatt

FE Package
28-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663 Rev K)
Exposed Pad Variation EB 9.60 – 9.80*
(.378 – .386)
4.75
(.187) 4.75
(.187) 28 27 26 2524 23 22 21 20 1918 17 16 15 6.60 В±0.10
4.50 В±0.10 2.74
(.108)
SEE NOTE 4 0.45 В±0.05 EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE 6.40
2.74
(.252)
(.108)
BSC 1.05 В±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT 4.30 – 4.50*
(.169 – .177) 0.09 – 0.20
(.0035 – .0079) 0.50 – 0.75
(.020 – .030) NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS …