Package Linear Technology TQFP-32/1 — Datenblatt

LUE Package
32-Lead Plastic Exposed Pad TQFP (5mm Г— 5mm)
(Reference LTC DWG # 05-08-1986 Rev A) 5.15 – 5.25 7.00 BSC 3.50 REF 5.00 BSC
32 0.50 BSC 1
2
3 32 3.50 REF 2.78 В±0.05 SEE NOTE: 4 1
2
3 7.00 BSC
5.00 BSC 2.78 ±0.10 5.15 – 5.25
0.22 – 0.30 A 2.78 ±0.05 A 0.30
REF 2.78 ±0.10 DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE DETAIL “B” PACKAGE OUTLINE
SEE NOTE: 5
1.30 MIN
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 1.20
0.95 – 1.05 MAX 12° TYP R0.08 – 0.20 GAUGE PLANE
0.25
0° – 7° 12° TYP 0.09 – 0.22 1.00 REF 0.50
BSC 0.05 – 0.15 …