Package Linear Technology SOT-23-5 — Datenblatt

S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635) 0.62
MAX 0.95
REF 2.90 BSC
(NOTE 4) 1.22 REF 1.4 MIN 3.85 MAX 2.62 REF 2.80 BSC 1.50 – 1.75
(NOTE 4) PIN ONE
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR 0.30 – 0.45 TYP
5 PLCS (NOTE 3) 0.95 BSC 0.80 – 0.90
0.20 BSC 0.01 – 0.10
1.00 MAX DATUM �A’ 0.30 – 0.50 REF
0.09 – 0.20
(NOTE 3)
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193 1.90 BSC
S5 TSOT-23 0302 …