Datasheet Texas Instruments HPA01108AIYZFR — Datenblatt
| Hersteller | Texas Instruments |
| Serie | TMP006 |
| Artikelnummer | HPA01108AIYZFR |
Kontaktloser Infrarot-Thermopile-Temperatursensor im WCSP-Paket 8-DSBGA -40 bis 125
Datenblätter
TMP006/B Infrared Thermopile Sensor in Chip-Scale Package datasheet
PDF, 725 Kb, Revision: E, Datei veröffentlicht: Apr 9, 2015
Status
| Lifecycle Status | NRND (Not recommended for new designs) |
| Manufacture's Sample Availability | No |
Verpackung
| Pin | 8 |
| Package Type | YZF |
| Industry STD Term | DSBGA |
| JEDEC Code | S-XBGA-N |
| Package QTY | 3000 |
| Carrier | LARGE T&R |
| Device Marking | TMP006 |
| Width (mm) | 1.75 |
| Length (mm) | 1.75 |
| Pitch (mm) | .5 |
| Max Height (mm) | .625 |
| Mechanical Data | Herunterladen |
Öko-Plan
| RoHS | Compliant |
Design Kits und Evaluierungsmodule
- Evaluation Modules & Boards: TMP006EVM
TMP006 Evaluation Module
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: BOOSTXL-SENSHUB
Sensor Hub BoosterPack
Lifecycle Status: Active (Recommended for new designs) - Development Kits: BOOSTXL-EDUMKII
Educational BoosterPack MKII
Lifecycle Status: Active (Recommended for new designs)
Anwendungshinweise
- TMP006 and TMP007: Through-Hole Mounting MethodPDF, 1.8 Mb, Datei veröffentlicht: Sep 1, 2016
This applicationnotedescribesa new methodof mountingTMP007WCSPdie on the printed-circuitboard(PCB).The advantagesof the new methodare describedand mountingrecommendationsare provided.All of the followingrecommendationsand conclusionsare also true for TMP006parts. - AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AG)PDF, 13.7 Mb, Revision: AG, Datei veröffentlicht: Aug 12, 2015
- Understanding the I2C BusPDF, 124 Kb, Datei veröffentlicht: Jun 30, 2015
Modellreihe
Serie: TMP006 (5)
- HPA01108AIYZFR TMP006AIYZFR TMP006AIYZFT TMP006BIYZFR TMP006BIYZFT
Herstellerklassifikation
- Semiconductors > Sensing Products > Temperature Sensors > Cable & Probe Temperature Sensors