Hermetic Packages for Integrated Circuits
Ceramic Quad Flatpack (CQFP)
0.012 M C A S -B S R68.A D S 68 LEAD CERAMIC QUAD FLATPACK PACKAGE
0.012 M C A S -B S D INCHES D S SYMBOL
D1 A
PIN NO. 1 L e
A
A
-AE1 e2 E -B-e1 bxN 0.008 M
A S -B S C D S MIN MILLIMETERS MAX 0.075 MIN 0.135 1.91 3.43 -0.016 0.023 0.41 0.58 2 b1 0.016 0.020 0.41 0.51 2 c 0.008 0.015 0.20 0.38 2 c1 0.008 0.012 0.20 0.31 2 D 1.640 1.870 41.66 47.50 -E 1.640 1.870 41.66 47.50 -D1 0.940 0.960 23.88 24.38 -E1 0.940 0.960 23.88 24.38 4 e 0.050 BSC -0.012 -0.31 -e2 0.012 -0.31 -L 0.350 0.450 8.89 Q 0.070 0.120 1.78 M -0.0015 -68 11.43
3.05
0.04
68 6
2
3 Rev. 0 11/19/96 c A Q -C(b)
b1 SECTION A-A 1.27 BSC e1 N c1 NOTES b -D-M MAX (c) NOTES:
1. Index area: A notch or a pin one identification mark shall
be located adjacent to pin one and shall be located within
the shaded area shown. The manufacturer’s identification
shall not be used as a pin one identification mark.
2. Dimensions b1 and c1 apply to lead base metal only.
Dimension M applies to lead plating and finish thickness.
The maximum limits of lead dimensions b and c or M shall …
