Plastic Packages for Integrated Circuits Package Outline Drawing M14.173 14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) Rev 3, 10/09 A 1 3 5.00 В±0.10 SEE DETAIL "X" 8 14 6.40 PIN #1 I.D. MARK 4.40 В±0.10 2 3 1 0.20 C B A 7 B 0.65 0.09-0.20 TOP VIEW END VIEW 1.00 REF 0.05 H C 0.90 +0.15/-0.10 1.20 MAX SEATING PLANE 0.25 +0.05/-0.06 0.10 C 0.10 GAUGE PLANE 0.25 5 0В°-8В° 0.05 MIN 0.15 MAX CBA SIDE VIEW 0.60 В±0.15 DETAIL "X" (1.45) NOTES: …
