Package Intersil M14.173 — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 3, 10/09
A
1 3 5.00 В±0.10
SEE
DETAIL "X" 8 14 6.40
PIN #1
I.D. MARK 4.40 В±0.10
2 3 1 0.20 C B A 7
B 0.65 0.09-0.20 TOP VIEW END VIEW 1.00 REF
0.05 H
C 0.90 +0.15/-0.10
1.20 MAX SEATING
PLANE
0.25 +0.05/-0.06
0.10 C 0.10 GAUGE
PLANE 0.25 5
0В°-8В° 0.05 MIN
0.15 MAX CBA SIDE VIEW 0.60 В±0.15
DETAIL "X" (1.45)
NOTES: …