Package Intersil Q64.10x10J — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
Q64.10x10J
64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE WITH EXPOSED PAD (EP-TQFP)
Rev 0, 5/16
12.00
4 5
10.00 D 3 EXPOSED PAD PIN 1
0.10
REF TYP.
3 A 10.00
12.00 7.30 В±0.15 4 5 B 0.50 3 4X 0.20 C A-B D 4X 0.20 H A-B D TOP VIEW
7.30 В±0.15
1.20 MAX 11/13В°
0.05 BOTTOM VIEW
// 0.10 C 0В° MIN. C
0.08
SEE DETAIL “A” SIDE VIEW 7 0.08 M C A-B H 2 1.00 ±0.05 D WITH LEAD FINISH 0.22 ±0.05 0.05/0.15
0.09/0.16 0.09/0.20 0.08
R. MIN
0.20 MIN.
DETAIL “A”
SCALE: NONE 0.20 В±0.03 0-7В° 0.25
GAUGE PLANE …