Package Intersil Q64.10x10H — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
Q64.10x10H
64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE WITH EXPOSED PAD (EP-TQFP)
Rev 0, 4/15
12.00 4 5
10.00 D 3 5.95 В±0.10 A 3 B 4 5
5.95 В±0.10 10.00 12.00 3
0
M .39
A 4
X 0.50 EXPOSED PAD
4X 4X 0.20 C A-B D 0.20 H A-B D TOP VIEW BOTTOM VIEW 1.20 MAX 11/13В°
0.05 VALUE FOR THETA
THETA 1 = 0В°
THETA 2 = 11/13В°
THETA 3 = 11/13В° / / 0.10 C
0.08 SEE DETAIL "A" H C WITH LEAD FINISH 0.22 В±0.05 пЃ±1
MIN 0.08
0.08/0.2 2 1.2 MAX 1.0 В±0.05
пЃ±3 0.08 M C A-B D 7 пЃ±2 0.1 В±0.05 0.25 0.2
0.6 В±0.15 0.09/0.20 DETAIL "A"
SCALE: NONE 0.09/0.16 1.00
REF 0.20 В±0.03 …